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Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
The ever-increasing packaging density of electronic products has led to a dramatic reduction in the dimensions of solder joints, which further...
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Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints
The electromigration mechanism of linear Cu/Sn3.5Ag0.5Bi8.0In/Cu and Cu/Sn3.0Ag0.5Cu/Cu solder joints has been systematically studied. The crystal...
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Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures
For the reliability of cryoelectronics, the tensile performance and fracture behavior of microscale Cu/Sn3.0Ag0.5Cu/Cu joints with shrinking size...
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Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and...
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Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix
In this paper, we proposed a method of strengthening Sn-based solder to retard the microstructural evolution during thermal cycling and thus to...
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Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints
Cu/Sn-3.0Ag-0.5Cu-xBi/Cu solder lap joints were prepared using Sn-3.0Ag-0.5Cu (SAC305) solder paste doped with 0, 1 wt%, 3 wt% and 7 wt% Bi powder,...
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Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates
This paper aims to study the effect of soldering time and ultrasonic-assisted time to microstructures, chemical compositions and thickness of...
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Microstructure and Properties of SiC Whisker Reinforced Sn-0.3Ag-0.7Cu Solder Alloy
In the present study, the effects of SiC whiskers on the microstructure of the SAC0307- x SiC ( x = 0 wt.%, 0.02 wt.%, 0.04 wt.%, 0.06 wt.%, 0.08 wt.%...
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Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints
The effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints was...
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Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering
Cu foams with 75% and 98% porosity were employed as reinforcing structures to enhance the performance of the Sn3.0Ag0.5Cu(SAC305)/Cu solder joints....
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Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties
A novel friction micro-welding (FMW) technology was used for copper column connection of column grid array (CGA) packaging. The investigation found...
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Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu
The trend toward miniaturized and highly integrated chip packaging has created a pressing need for lead-free solders with high strength, toughness,...
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Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)
The purpose of this chapter is to provide an overview of current and future deployment of second level interconnect reliability on types of second...
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Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints
Printed circuit board (PCB) is widely used in electronic packaging and plays a role in supporting the electronic components by providing electrical...
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Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
Creep tests were performed using a fixture composed of a spring, a micrometer and a heating pad to apply both heat and constant compressive load and...
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Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
High entropy alloy (HEA) receives noticeable attention in the electronic industry, and one of the best ways to incorporate HEA with the existing...
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Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure
Solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure was designed and fabricated by two-step soldering process. Sn, Ag, and Cu atoms...
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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder
A clear understanding of the characteristics of solder wetting to component terminations is critical for establishing thermal process profiles that...
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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder...
