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Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates

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Abstract

This paper aims to study the effect of soldering time and ultrasonic-assisted time to microstructures, chemical compositions and thickness of intermetallic compounds (IMCs) of three types solder joints after soldering at 290 °C. The Sn3.0Ag0.5Cu (SAC305) solder and three types substrate (pure Cu, Cu–50Co and Cu–50Fe) were selected. The results showed that the compounds formed at the SAC305/Cu solder joint were Cu3Sn and spherical Cu6Sn5, the stick-like (Co,Cu)Sn3 and finely needle-like (Cu,Co)6Sn5 were generated in SAC305/Cu–50Co, while the prismatic (Cu,Fe)6Sn5 and finely granular FeSn2 were produced in SAC305/Cu–50Fe. With the soldering time increased, the IMC overall thickness of all three types solder joints gradually increased. While ultrasound was used, the morphology of Cu6Sn5, (Co,Cu)Sn3 and (Cu,Fe)6Sn5 transformed into prismatic shapes, blocky and slender stick due to cavitation and acoustic flow effects. Moreover, with the application of ultrasound, the IMC thickness of SAC305/Cu and SAC305/Cu–50Co solder joints decreased first then started to up, while that of SAC305/Cu–50Fe solder joints decreased and then remained unchanged.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 52165047).

Funding

This study was funded by National Natural Science Foundation of China, Grant Number 52165047, **aowu Hu.

Author information

Authors and Affiliations

  1. School of Advanced Manufacturing, Nanchang University, Nanchang, 330031, China

    Jue Wang, Chao Li, Jiatao Zhou, Zezong Zhang, Bin Chen, **ongxin Jiang & **aowu Hu

  2. School of Physics and Materials Science, Nanchang University, Nanchang, 330031, China

    Wen**g Chen

  3. School of Institute for Advanced Study, Nanchang University, Nanchang, 330031, China

    Dingjun Liu

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  1. Jue Wang
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Contributions

JW: Conceptualization, Methodology, Sample Preparation, Formal analysis, Investigation, Data curation, Writing—original draft, Visualization. WC: Investigation, Data curation, Visualization. DL: Conceptualization, Methodology, Formal analysis, Investigation, Data curation, Visualization. CL: Methodology, Sample Preparation, Formal analysis, Investigation, Data curation. JZ: Methodology, Supervision, Resources, Writing—review & editing. ZZ: Sample Preparation, Formal analysis, Data curation. BC: Writing—original draft, Supervision. XJ: Investigation, Formal analysis. XH: Conceptualization, Methodology, Formal analysis, Investigation, Writing—original draft, Visualization.

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Correspondence to Dingjun Liu or **aowu Hu.

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Wang, J., Chen, W., Liu, D. et al. Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates. J Mater Sci: Mater Electron 34, 1517 (2023). https://doi.org/10.1007/s10854-023-10959-w

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