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Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints

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Abstract

Cu/Sn-3.0Ag-0.5Cu-xBi/Cu solder lap joints were prepared using Sn-3.0Ag-0.5Cu (SAC305) solder paste doped with 0, 1 wt%, 3 wt% and 7 wt% Bi powder, respectively. The different samples were immersed in 3.5 wt% NaCl solution for a maximum of 28 days, and the corrosion products were SnO, SnO2 and Sn3O(OH)2Cl2. The samples were observed and tested at different periods of the study, and the shear strength, corrosion morphology, XRD phase diagrams and weight changes of the joints were compared with those of the joints with different do** concentrations. The results showed that the shear strength of SAC305 solder joints increased and then decreased with the increase of Bi do** concentration. Although the 7 wt% Bi doped lap joint had the lowest shear strength and was still the lowest at the end of the 28 day immersion corrosion tests, the decrease in shear strength with increasing immersion time was the slowest compared to the joints with other Bi do** concentrations. The results suggest that high concentrations of Bi do** in SAC305 solder joints have a corrosion-blocking effect.

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Funding

This work was supported by the National Natural Science Foundation of China (No. 52165047 and 52361009).

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Authors and Affiliations

  1. School of Advanced Manufacturing, Nanchang University, Nanchang, 330031, China

    Langfeng Zhu, **aowu Hu, Zezong Zhang, Bin Chen, Jue Wang, Sifan Tan & **ongxin Jiang

  2. School of Physics and Materials Science, Nanchang University, Nanchang, 330031, China

    Wen**g Chen

Authors
  1. Langfeng Zhu
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  2. Wen**g Chen
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  3. **aowu Hu
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  4. Zezong Zhang
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  5. Bin Chen
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  8. **ongxin Jiang
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Contributions

LZ: Conceptualization, Methodology, Sample Preparation, Formal analysis, Investigation, Data curation, Writing—original draft, Visualization. WC: Investigation, Data curation, Visualization. XH: Methodology, Supervision, Resources, Writing—review and editing. ZZ: Methodology, Formal analysis, Data curation, Investigation. BC: Methodology, Formal analysis, Data curation. JW: Formal analysis, Data curation. ST: Sample Preparation, Methodology. XJ: Formal analysis, Investigation.

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Correspondence to Wen**g Chen, **aowu Hu or **ongxin Jiang.

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Zhu, L., Chen, W., Hu, X. et al. Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints. J Mater Sci: Mater Electron 35, 111 (2024). https://doi.org/10.1007/s10854-024-11942-9

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