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Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)

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Interconnect Reliability in Advanced Memory Device Packaging

Part of the book series: Springer Series in Reliability Engineering ((RELIABILITY))

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Abstract

The purpose of this chapter is to provide an overview of current and future deployment of second level interconnect reliability on types of second level solder alloys used in semiconductor assembly and packaging.

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Authors and Affiliations

  1. Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan

    Chong Leong, Gan & Chen-Yu, Huang

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  1. Chong Leong, Gan
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  2. Chen-Yu, Huang
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Correspondence to Chong Leong, Gan .

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Gan, C.L., Huang, CY. (2023). Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD). In: Interconnect Reliability in Advanced Memory Device Packaging. Springer Series in Reliability Engineering. Springer, Cham. https://doi.org/10.1007/978-3-031-26708-6_5

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  • DOI: https://doi.org/10.1007/978-3-031-26708-6_5

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-031-26707-9

  • Online ISBN: 978-3-031-26708-6

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