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High-sensitivity flip chip blue Mini-LEDs miniaturized optical instrument for non-invasive glucose detection
The colorimetric detection of glucose typically involves a peroxidase reaction producing a color, which is then recorded and analyzed. However,...
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Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Paper-based electronics is an emerging concept with the prospect of develo** recyclable, low cost, flexible, and green products such as paper...
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Fractures of ultra-low-k material in a chip during a flip-chip process
The low-k/ultra-low-k (LK/ULK) dielectric materials are incorporated in the 40 nm technology node and beyond to reduce resistance and capacitance...
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Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps
AbstractTo understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5Ag solder bumps, EM tests were performed with...
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Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps
Lately, as electronic devices are continually becoming smaller, thinner, and multifunctional, there has been a growing demand for highly integrated...
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Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package
The increasing demand over the higher density and smaller form factor of memory packages have become a mainstream due to the boom of artificial...
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Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration
The present work investigated the effect of Ag additives on the consumption of cathode Cu pad under electromigration in a current-stressed...
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Reliability of Flip-Chip Filaments with Different Color Temperatures
Light-emitting diode (LED) lamps with different color temperatures have been widely used for various applications. Compared with LED filaments having...
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Effect of Different Soldering Temperatures on the Solder Joints of Flip-Chip LED Chips
This paper investigates the effect of different soldering temperatures on the performance of the flip-chip light-emitting diode (FC-LED) filament...
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Laser Lift-Off of the Sapphire Substrate for Fabricating Through-AlN-Via Wafer Bonded Absorption Layer Removed Thin Film Ultraviolet Flip Chip LED
In this study we report chip fabrication process that allows the laser lift-off of the sapphire substrate for the transfer of the GaN based thin film...
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Design of high-speed, low-power non-volatile master slave flip flop (NVMSFF) for memory registers designs
High-speed and low-power area-efficient memory solutions are in high demand in today’s smart and internet environment. To program and store data and...
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Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection
Thermal compression bonding (TCB) has been widely used in flip chip bonding processes for three-dimensional integrated packaging. Therefore, studying...
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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced...
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Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging
The wettability and growth of intermetallic compounds (IMCs) of stud bump materials Ag, Ag-4Pd, Cu, and Au with Sn-3Ag-0.5Cu (SAC305) solder have...
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System-on-Chip Design with State-of-Art Transistors
This book chapter is going to explore the design considerations and challenges associated with system-on-chip (SoC) design using state-of-the-art...
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Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
Creep tests were performed using a fixture composed of a spring, a micrometer and a heating pad to apply both heat and constant compressive load and...
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Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints
This paper investigates the influence of the welding process on the microstructure and mechanical properties of Au/Sn–3.0Ag–0.5Cu/Cu solder joints....
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Influencing Factors of Fatigue Life of Nano-Silver Paste in Chip Interconnection
The finite element software ANSYS was used to simulate the solder joints in the flip chip, and the stress and strain distribution results of the...
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Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound
The method of introducing ultrasonic action was used to bond the flip chip with copper pillar solder joints, and the influence of ultrasonic...
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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction
This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study the effect of different Cu pillar bump diameters on...
