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Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

  • Original Paper - Electronics, Magnetics and Photonics
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Abstract

To understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5Ag solder bumps, EM tests were performed with changes in the pad opening size and solder bump height at 140 °C and 4.6 × 104 A/cm2. Additionally, to exclude extrinsic factors such as Joule heating, EM behavior was observed using a multi Sn96.5Ag3.0Cu0.5 solder line sample at 150 °C and 6–7.5 × 104 A/cm2. The EM lifetime increased with decreasing pad opening size and bump height, and the EM critical current density (Jth) increased with decreasing line length. This result indicates that the EM resistance increases as the dimensions of the solder bump decreases, which can be understood by the EM jL product.

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Acknowledgements

This research was supported by Korea Institute for Advancement of Technology(KIAT) grant funded by the Korea Government(MOTIE)(P0008458, HRD Program for Industrial Innovation) and, the Technology Innovation Program (20016465, Development of dissimilar metal forming/joining technology for heat dissipation modules of energy first class efficiency electronic products and 20017189, Development of non cyanide gold bump solution and plating process for semiconductor device bonding process) funded By the Ministry of Trade. The authors would like to thank Mr. S. -T. Yang, Mr. Q. -H. Chung, K. -Y. Byun, and Dr. M. -S. Suh from SK Hynix Semiconductor Inc. and also Dr. M. -S. Yoon at Seoul National University for test sample preparations.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Andong National University, 1375 Gyeongdong‑ro, Andong-si, Gyeongsangbuk-do, 36729, Republic of Korea

    Gahui Kim, Kirak Son & Young-Bae Park

  2. SK Hynix Inc., 2091 Gyeongchung-daero, Bubal-eup, Icheon-si, Gyeonggi-do, 17336, Republic of Korea

    Jang-Hee Lee

  3. Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea

    Young-Chang Joo

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  1. Gahui Kim
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Correspondence to Young-Bae Park.

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Kim, G., Son, K., Lee, JH. et al. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps. Electron. Mater. Lett. 18, 431–439 (2022). https://doi.org/10.1007/s13391-022-00356-6

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  • DOI: https://doi.org/10.1007/s13391-022-00356-6

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