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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction

  • Topical Collection: Electronic Packaging and Interconnections 2023
  • Published:
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Abstract

This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study the effect of different Cu pillar bump diameters on thermal and mechanical performance during the reflow soldering process. The desktop reflow oven is modeled in ANSYS FLUENT, while the ball grid array (BGA) package assembly is modeled in ANSYS STATIC STRUCTURAL. The accuracy of the simulated reflow temperature profile has been verified by comparing it with the experimental temperature data, according to JEDEC standards. The temperature distributions of solder and Cu pillar bumps are compared. A parametric study has been conducted to analyze the effect of different Cu pillar diameters on the reflow soldering process. By coupling the thermal loads with the structural analysis using thermal FSI, Cu pillar bumps with a diameter of 0.20 mm are found to exhibit the lowest reflow temperature, minimum temperature difference, and minimum deformation and thermal stress, making them the most suitable interconnection joints for flip chip technology. The study also examines the effect of soldering materials on the Cu pillar bump. The findings of this research provide valuable insights into the effects of varying Cu pillar diameters on the reflow soldering process, which can help in the development of more reliable electronic assemblies.

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Acknowledgments

The work is financially supported by the Ministry of Higher Education under Fundamental Research Grant Scheme, FRGS (Grant number FRGS/1/2020/TK0/USM/03/6). The authors would also like to thank Universiti Sains Malaysia and Western Digital Sdn. Bhd. for providing technical support.

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Authors and Affiliations

  1. School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal, 14300, Seberang Perai Selatan, Penang, Malaysia

    **g Rou Lee, Mohd Sharizal Abdul Aziz & Roslan Kamarudin

  2. Faculty of Mechanical Engineering & Technology, Universiti Malaysia Perlis, Perlis, Malaysia

    Chu Yee Khor

  3. School of Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal, 14300, Seberang Perai Selatan, Penang, Malaysia

    Mohammad Hafifi Hafiz Ishak

  4. Western Digital, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia

    F. Che Ani

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Correspondence to Mohd Sharizal Abdul Aziz.

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Lee, J.R., Abdul Aziz, M.S., Khor, C.Y. et al. Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction. J. Electron. Mater. 53, 1201–1213 (2024). https://doi.org/10.1007/s11664-023-10855-3

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