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Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
The ever-increasing packaging density of electronic products has led to a dramatic reduction in the dimensions of solder joints, which further...
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Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints
The electromigration mechanism of linear Cu/Sn3.5Ag0.5Bi8.0In/Cu and Cu/Sn3.0Ag0.5Cu/Cu solder joints has been systematically studied. The crystal...
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Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures
For the reliability of cryoelectronics, the tensile performance and fracture behavior of microscale Cu/Sn3.0Ag0.5Cu/Cu joints with shrinking size...
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Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and...
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Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix
In this paper, we proposed a method of strengthening Sn-based solder to retard the microstructural evolution during thermal cycling and thus to...
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Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints
Cu/Sn-3.0Ag-0.5Cu-xBi/Cu solder lap joints were prepared using Sn-3.0Ag-0.5Cu (SAC305) solder paste doped with 0, 1 wt%, 3 wt% and 7 wt% Bi powder,...
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Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates
This paper aims to study the effect of soldering time and ultrasonic-assisted time to microstructures, chemical compositions and thickness of...
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Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints
The effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints was...
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Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering
Cu foams with 75% and 98% porosity were employed as reinforcing structures to enhance the performance of the Sn3.0Ag0.5Cu(SAC305)/Cu solder joints....
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Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties
A novel friction micro-welding (FMW) technology was used for copper column connection of column grid array (CGA) packaging. The investigation found...
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Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu
The trend toward miniaturized and highly integrated chip packaging has created a pressing need for lead-free solders with high strength, toughness,...
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Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints
Printed circuit board (PCB) is widely used in electronic packaging and plays a role in supporting the electronic components by providing electrical... -
Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
Creep tests were performed using a fixture composed of a spring, a micrometer and a heating pad to apply both heat and constant compressive load and...
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Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
High entropy alloy (HEA) receives noticeable attention in the electronic industry, and one of the best ways to incorporate HEA with the existing...
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Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure
Solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure was designed and fabricated by two-step soldering process. Sn, Ag, and Cu atoms...
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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder
A clear understanding of the characteristics of solder wetting to component terminations is critical for establishing thermal process profiles that...
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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder...
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Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints
This paper studies the influence of trace elements Ag, Bi and Ni on the solid-liquid electromigration (S-L EM) interface diffusion behavior in solder...
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Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures
In the actual production process, soldering is a key step in the flip-chip packaging process. The reliability of the interconnection interface of...