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Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

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Abstract

This paper studies the influence of trace elements Ag, Bi and Ni on the solid-liquid electromigration (S-L EM) interface diffusion behavior in solder joints. The solder joint Sn0.7Ag0.5Cu (SAC0705), Sn3.0Ag0.5Cu (SAC305) and Sn0.7Ag0.5Cu3.5Bi0.05Ni (SAC0705+BiNi) are taken as the research object. The interfacial intermetallic compound (IMC) growth and evolution behavior were studied after S-L EM. Meanwhile, the influences of the trace elements Ag, Bi and Ni on interface diffusion were analyzed in the solder joint during S-L EM. The results show that the interfacial IMC grains can be refined by adding trace elements Ag, Bi and Ni in solder during reflowing. The addition of Bi and Ni changed the composition and shape of the interfacial IMC. After adding Bi and Ni to the SAC0705 solder alloy, the interfacial IMC changed from polygonal cylindrical Cu6Sn5 to ellipsoidal (Cu,Ni)6Sn5. The addition of Ag, Bi and Ni inhibited the growth of the cathodic interfacial IMC and improved the resistance to the S-L EM performance of the solder joints. Compared with Cu/SAC0705/Cu solder joints, the cathodic interfacial IMC grain size of Cu/SAC0705+BiNi/Cu solder joint decreased by 87%, and the thickness of the cathodic Cu substrate decreased by 29% after S-L EM.

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Acknowledgments

This work was supported by the Qiqihar Science and Technology Project (GYGG-201909), the Young Core Foundation of Heilongjiang Department of Education (135309374), the Basic Scientific Research Business Expense Research Project of Heilongjiang Provincial Colleges and Universities (135409102), and National Natural Science Foundation of China (51174069).

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Authors and Affiliations

  1. School of Mechanical and Electronic Engineering, Qiqihar University, Qiqihar, 161006, China

    Xuemei Li, Zihao Liu, Cheng Li, Yu**n Guo, Dawei Wang & Rui Fan

  2. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, China

    Xuemei Li & Fenglian Sun

  3. Collaborative Innovation Center of Intelligent Manufacturing Equipment Industrialization, Qiqihar, 161006, Heilongjiang Province, China

    Xuemei Li

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  1. Xuemei Li
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  2. Zihao Liu
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Li, X., Liu, Z., Li, C. et al. Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints. J. Electron. Mater. 50, 5312–5317 (2021). https://doi.org/10.1007/s11664-021-08942-4

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  • DOI: https://doi.org/10.1007/s11664-021-08942-4

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