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1. Thermomigration-induced failure in ball grid array solder joint under high current stressing

   In this work, rapid failure of a few minutes was observed in real ball grid array solder joints under high current density (8 × 10 ³ and 1 × 10 ⁴  A cm ⁻² ...

   Peng Liu, Sen Cong, ... ** Wu in Journal of Materials Science

   Article 18 June 2023
   

2. Thermomigration behavior of Sn–Bi joints under different substrate

   In this work, the atomic migration behavior in Sn-58Bi solder joints was investigated under the condition of a temperature gradient. The effect of...

   Jun Wu, Kaipeng Wang, ... Mingqing Liao in Journal of Materials Science: Materials in Electronics

   Article 02 March 2022
   

3. Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films

   Self-induced temperature gradients produced due to passage of electric current through thin film interconnects with bends can be very large, making...

   Nalla Somaiah, Praveen Kumar in Journal of Electronic Materials

   Article 23 September 2019

4. Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface

   As chip integration increases and micro-bump size reduces in 3D integrated circuits (ICs), issues with service reliability due to electromigration...

   **ye Yao, Min Shang, ... Zhaoqing Gao in Journal of Materials Science: Materials in Electronics

   Article 06 May 2024
   

5. Inhibition of roof-type Cu₆Sn₅ grains on migration of Cu atoms under temperature gradient

   The thermomigration (TM) caused by nonuniform joule heat in micro-solder joints seriously threaten the reliability of electronic device. In this...

   Yuan Li, Lianyong Xu, ... Yongdian Han in Journal of Materials Science

   Article 27 December 2023
   

6. Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint

   Sn-Bi- X solders are widely used in electronic packaging industry. However, thermomigration (TM) behaviors of Sn-Bi- X solder joints and the...

   Yinbo Chen, Zhaoqing Gao, Zhi-Quan Liu in Acta Metallurgica Sinica (English Letters)

   Article 06 January 2022
   

7. Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

   Cu-cored solder interconnects have been demonstrated to increase the performance of interconnect structures, while the quantitative understanding of...

   Shuibao Liang, Han Jiang, Jiaqiang Huang in Journal of Electronic Materials

   Article Open access 12 December 2023
   

8. Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders

   Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of...

   Sung-Min Baek, Yu** Park, ... Namhyun Kang in Journal of Electronic Materials

   Article 26 November 2018

9. Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding

   Hourglass-shaped microbump joints are expected to be used in three-dimensional (3D) chip stacking interconnect technology due to their strong...

   Chu Tang, Zhuo Chen, Wenhui Zhu in Journal of Materials Science: Materials in Electronics

   Article 07 March 2023
   

10. Orientation transformation of Cu₆Sn₅ grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

    Cu ₆ Sn ₅ intermetallic compound (IMC), which occupies most even full of solder joints bringing by the reduced size of interconnection and the...

    Yuanyuan Qiao, Hongwei Liang, Ning Zhao in Journal of Materials Science

    Article 27 February 2023
    

11. The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

    With low liquidus temperatures, low raw material costs, and non-toxicity, Sn-Bi low-temperature solders are promising candidates for the replacement...

    **n F. Tan, Qichao Hao, ... Kazuhiro Nogita in Journal of Electronic Materials

    Article 06 December 2023
    

12. Effect of Cu₆Sn₅ nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints

    The ever-increasing packaging density of electronic products has led to a dramatic reduction in the dimensions of solder joints, which further...

    Ziwen Lv, **tao Wang, ... Hongtao Chen in Journal of Materials Science: Materials in Electronics

    Article 10 March 2023
    

13. Effect of External Magnetic Field on Grain Boundary Migration in Non-magnetic Systems: A Phase-Field Study

    In this work, we propose a phase field model to investigate grain boundary (GB) migration under an external magnetic field in a non-magnetic Bismuth...

    Soumya Bandyopadhyay, Somnath Bhowmick, Rajdip Mukherjee in Proceedings of the International Conference on Metallurgical Engineering and Centenary Celebration

    Conference paper 2024
    

14. Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies

    The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure, mechanical strength, and structural integrity of...

    Zongye Ding, Naifang Zhang, ... Qiaodan Hu in Acta Metallurgica Sinica (English Letters)

    Article 27 January 2021
    

15. Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process

    In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow process significantly affect the mechanical properties of...

    Yen-Jui Cheng, Cheng-Hsin Lu, Fan-Yi Ouyang in Journal of Electronic Materials

    Article 23 October 2021
    

16. Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding

    This study employed an improved thermal compression bonding process with two temperature settings (180 °C/250 °C, 250 °C/250 °C) to rapidly fabricate...

    Chen Chen, Liang Zhang, ... ** Huang in Journal of Materials Science: Materials in Electronics

    Article 22 April 2024
    

17. In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu₆Sn₅ nanoparticles

    The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the...

    Ziwen Lv, **tao Wang, ... Hongtao Chen in Journal of Materials Science: Materials in Electronics

    Article 04 July 2023
    

18. The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields

    We reported the reliability of Sn0.3Ag0.7Cu (SAC0307) solder joints under electrical and thermal coupling fields, where the c -axes of Sn grains were...

    Yu Tian, Limin Ma, ... Zhijie Sun in Journal of Electronic Materials

    Article 16 October 2019

19. Formation mechanism and reliability of preferred growth full Cu₆Sn₅ intermetallic compound interconnect on (011) Cu single-crystal substrate

    The preferred growth full intermetallic compound (IMC) interconnect was fabricated using the current driven bonding (CDB) method. The morphology,...

    M. L. Huang, L. Zou, Y. Wu in Journal of Materials Science: Materials in Electronics

    Article 17 October 2022
    

20. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

    Abstract

    To understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5Ag solder bumps, EM tests were performed with...

    Gahui Kim, Kirak Son, ... Young-Bae Park in Electronic Materials Letters

    Article 04 July 2022