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Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process

  • Electronic Packaging and Interconnections 2021
  • Published:
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Abstract

In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow process significantly affect the mechanical properties of the devices. In this study, In solder and Ni under-bump metallization (UBM) were chosen to investigate the solid–liquid interfacial reaction under an isothermal reflow process. Two types of IMCs, uniform and scallop-type, were formed in turn after being reflowed at three different temperatures, 220°C, 250°C, and 280°C. Elemental analysis has revealed that the compositions of both types of IMCs are nearly the same and were eventually identified as Ni3In7. By the growth rate of IMC formation, the mechanism of the growing process was proposed to be a diffusion-controlled process. The activation energy (Q) of the IMC formation was calculated to be 83.8 \(\frac{{ {\text{kJ}}}}{{{\text{mol}}}}\).

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Acknowledgments

The authors are grateful for the funding support from the Ministry of Science and Technology of Taiwan, R.O.C., under contract nos. 108-2221-E-007-055-MY3 and 110-2811-M-007-507. The authors would also like to thank the Instrumentation Center at National Tsing Hua University (NTHU) for their JEOL JSM-6500F Field Emission Scanning Electron Microscope analysis.

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  1. Department of Engineering and System Science, National Tsing Hua University, Hsinchu, 30013, Taiwan

    Yen-Jui Cheng, Cheng-Hsin Lu & Fan-Yi Ouyang

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Cheng, YJ., Lu, CH. & Ouyang, FY. Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process. J. Electron. Mater. 50, 6575–6583 (2021). https://doi.org/10.1007/s11664-021-09253-4

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