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Thermomigration behavior of Sn–Bi joints under different substrate

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Abstract

In this work, the atomic migration behavior in Sn-58Bi solder joints was investigated under the condition of a temperature gradient. The effect of different substrates including Cu, Ni and Co on microstructural evolution in the solder was also compared. It was found that the main migrating element in Sn-58Bi solder was Bi in the direction of temperature gradient to produce certain Bi-rich phases at the cold end. With the change of hot end from Cu to Ni or Co, the thermal migration rate of Bi phase and the growth rate of interfacial Intermetallic compounds (IMC) were significantly depressed, which can be attributed to the decrease of the temperature gradient in the solder joint. In particular, there is no obvious asymmetric growth during the growth of IMC at both ends of the interface, which is different from other Sn-based Pb-free solders. Finally, finite element simulation analysis also verified the excellent thermal migration resistance of Co and Ni substrates.

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Data availability

The data and materials that support the findings of this study are available from the corresponding author upon reasonable request.

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Funding

This research was funded by the National Natural Science Foundation of China, Grant No. 51875269, and by Qing Lan Project from Jiangsu Province.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangsu University of Science and Technology, 212003, Zhenjiang, People’s Republic of China

    Jun Wu, Kaipeng Wang, Fengjiang Wang & Mingqing Liao

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  1. Jun Wu
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  2. Kaipeng Wang
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  3. Fengjiang Wang
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  4. Mingqing Liao
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Contributions

KW: Methodology, Formal analysis, and Data curation. JW: Formal analysis, Methodology, and Data curation and Writing-original draft. ML: Data curation. FW: Conceptualization, Methodology, and Writing—review & editing.

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Correspondence to Fengjiang Wang or Mingqing Liao.

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Wu, J., Wang, K., Wang, F. et al. Thermomigration behavior of Sn–Bi joints under different substrate. J Mater Sci: Mater Electron 33, 8127–8139 (2022). https://doi.org/10.1007/s10854-022-07962-y

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  • DOI: https://doi.org/10.1007/s10854-022-07962-y

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