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  1. No Access

    Article

    Experimental investigation of phase equilibria in the Al–Ni–Sc system

    Phase equilibria in Al–Ni–Sc ternary system have been measured through alloy sampling. According to the results from electron probe microanalysis and X-ray diffraction techniques, isothermal sections of Al–Ni–...

    J. Q. He, L. Fan, H. S. Liu, H. L. Peng, Z. P. ** in Journal of Materials Science (2019)

  2. No Access

    Article

    Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

    The microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu sandwich joints during transient liquid phase (TLP) bonding were investigated in this study. The results show that the Au–Sn solder reacte...

    J. Peng, H. S. Liu, H. B. Ma, X. M. Shi, R. C. Wang in Journal of Materials Science (2018)

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    Article

    Experimental investigation on phase equilibria of Cu–Ti–Hf system and performance of Cu(Ti, Hf)2 phase

    Phase relations in Cu–Ti–Hf ternary system have been studied by diffusion triple technique supplemented with typical alloy sampling method. Based on results from electron-probe microscopy analysis and X-ray di...

    J. L. Liu, X. M. Huang, G. H. Li, G. M. Cai, H. S. Liu in Journal of Materials Science (2018)

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    Article

    Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates

    Mechanical reliability of transient liquid phase (TLP) bonded Au–Sn/Ni(Cu) joints was investigated in this study. The results show that the TLP bonded Au–Sn/Ni(Cu) joints have excellent mechanical performance,...

    J. Peng, R. C. Wang, H. S. Liu, J. Y. Li in Journal of Materials Science: Materials in… (2018)

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    Article

    Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C

    Interfacial reaction and shear behavior of the joints between the Au–29Sn (at.%) solder and the Ni–xCo (x = 20, 40, 60, and 80 at%) alloys soldered at 350 °C for various durations were investigated in this study....

    J. Peng, R. C. Wang, M. Wang, H. S. Liu in Journal of Materials Science: Materials in… (2017)

  6. No Access

    Article

    Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C

    Interfacial reaction and shear behavior of the joints between Au-29Sn (at.%) solder and Ni-xCu (x = 20 at.%, 40 at.%, 60 at.%, and 80 at.%) substrate alloys soldered at 350°C for various durations were investigat...

    J. Peng, R. C. Wang, M. Wang, H. S. Liu in Journal of Electronic Materials (2017)

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    Article

    Experimental investigation of phase equilibria in the Ti–Al–Mo ternary system

    Phase equilibria in Ti–Al–Mo ternary system are of fundamental importance to better acquire the phase-forming regulation of TiAl-based alloys. In this paper, phase relations in this system have been investigat...

    X. M. Huang, L. L. Zhu, G. M. Cai, H. S. Liu, Z. P. ** in Journal of Materials Science (2017)

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    Article

    Quenching and Partitioning of Ultrahigh Carbon (1.69 Mass% C) Steel

    Quenching and partitioning (Q&P) or quenching and tempering (Q&T) process of modified ultrahigh carbon steel (UHCS, Fe–1.69C–1.38Si–1.84Mn–2.20Cr–0.54Mo–0.43Ni wt%) was investigated by means of scanning electr...

    Y. H. Luo, H. S. Liu, Z. P. **, F. Zheng in Metallography, Microstructure, and Analysis (2016)

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    Article

    Experimental investigation of phase equilibria in the Cu–Ni–Zr system

    Phase equilibria in the Cu–Ni–Zr ternary system have been measured through alloy sampling combined with diffusion couple approach. According to the phase relations identified with electron probe microanalysis ...

    K. L. Lv, Z. Y. **e, H. S. Liu, G. M. Cai, Z. P. ** in Journal of Materials Science (2015)

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    Article

    Magnetic properties of Fe78.4Si9.5B9Cu0.6Nb2.5 nanocrystalline alloy powder cores

    The microstructure and morphology of nanocrystalline Fe78.4Si9.5B9Cu0.6Nb2.5 alloy powders prepared by ball milling technique were characterized by X-ray diffraction and scanning electron microscopy studies. The ...

    J. Zhou, Y. F. Cui, H. S. Liu, W. Wang, K. Peng, Y. D. **ao in Journal of Materials Science (2011)

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    Article

    Thermodynamic assessment of Co–Al–W system and solidification of Co-enriched ternary alloys

    Based on the assessed three constituent binary systems and reported phase diagram data, the Co–Al–W ternary system was thermodynamically optimized by using CALculation PHAse Diagram (CALPHAD) method. The newly...

    Y. F. Cui, X. Zhang, G. L. Xu, W. J. Zhu, H. S. Liu in Journal of Materials Science (2011)

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    Article

    Sliding friction properties of austenite- and martensite-based white cast iron containing 8.5% chromium

    In this paper, the wear resistance and track of austenite- and martensitic-based white cast iron (AWCI and MWCI) containing 8.5% chromium have been investigated with micro-fricative wear tester, optical micros...

    J. Q. Xu, Y. Y. Chen, W. Wang, K. P. Liu, H. S. Liu in Journal of Materials Science (2010)

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    Article

    Investigation of the Hot-Stam** Process for Advanced High-Strength Steel Sheet by Numerical Simulation

    Hot forming is a new way to manufacture complex-shaped components of advanced high-strength steel (AHSS) sheet with a minimum of spring-back. Numerical simulation is an effective way to examine the hot-forming...

    H. S. Liu, Z. W. **ng, J. Bao, B. Y. Song in Journal of Materials Engineering and Perfo… (2010)

  14. No Access

    Article

    Thermodynamic Assessment of the Au-Co-Sn Ternary System

    Phase relationships in the Au-Co-Sn ternary system have been thermodynamically assessed by using the CALPHAD technique. The existing thermodynamic descriptions of the binary Au-Sn and Co-Sn systems were improv...

    H. Q. Dong, S. **, L. G. Zhang, J. S. Wang, X. M. Tao in Journal of Electronic Materials (2009)

  15. No Access

    Article

    Thermodynamic Modeling of the Au-Bi-Sb Ternary System

    Based on the available experimental information, the Au-Bi binary system has been thermodynamically assessed using the CALPHAD method. The solution phases, including liquid, fcc_A1, and rhombohedral_A7, were m...

    J. Wang, F.G. Meng, H.S. Liu, L.B. Liu, Z.P. ** in Journal of Electronic Materials (2007)

  16. No Access

    Article

    Interfacial reaction between Sn-Bi alloy and Ni substrate

    Interfacial reactions between Sn-Bi alloys of different compositions and Ni substrates at 423 K for different durations were investigated. Only one interfacial phase, Ni3Sn4, was detected despite the existence of...

    J. Wang, H. S. Liu, L. B. Liu, Z. P. ** in Journal of Electronic Materials (2006)

  17. No Access

    Article

    Thermodynamic modeling of the Au-In-Sn system

    The phase diagram of the Au-In-Sn system is of importance in develo** materials of high performance in electronic packaging as well as in simulating the interfacial reaction between Sn-In and Au. By using th...

    H. S. Liu, C. L. Liu, K. Ishida, Z. P. ** in Journal of Electronic Materials (2003)

  18. No Access

    Article

    Thermodynamic modeling of the Au-In-Sb ternary system

    The phase diagram of the Au-In-Sb ternary system is of importance in predicting the interface reaction between In-based solders and the Au substrate. Using the calculated phase diagram method and based on expe...

    H. S. Liu, C. L. Liu, C. Wang, Z. P. **, K. Ishida in Journal of Electronic Materials (2003)

  19. No Access

    Article

    Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system

    The phase equilibria of the Cu-In-Sn system were investigated by means of the diffusion couple method, differential scanning calorimetry (DSC) and metallography. The isothermal sections at 110–900 C, as well a...

    X. J. Liu, H. S. Liu, I. Ohnuma, R. Kainuma, K. Ishida in Journal of Electronic Materials (2001)

  20. No Access

    Article

    Deep levels, electrical and optical characteristics in SnTe-Doped GaSb Schottky Diodes

    The GaSb layers investigated were grown directly on GaAs substrates by molecular beam epitaxy (MBE) using SnTe source as the n-type dopant. By using admittance spectroscopy, a dominant deep level with the acti...

    J. F. Chen, N. C. Chen, H. S. Liu in Journal of Electronic Materials (1996)

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