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  1. No Access

    Article

    Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications

    Sn-Ag-Cu solder pastes are widely used as the joining material in the electronic assembly process. The aim of this work was to evaluate the nonlinear viscoelastic behaviors of three different Sn-Ag-Cu solder p...

    Sabuj Mallik, Erica Hiu Laam Chan, Ndy Ekere in Journal of Materials Engineering and Perfo… (2013)

  2. No Access

    Article

    Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bum** for Sub-100 μm size solder bumps

    Stencil printing for flip chip packaging using fine particle solder pastes is a low cost assembly solution with high throughput for fine pitch solder joint interconnects. The manufacturing challenges associate...

    Santosh Kumar, Sabuj Mallik, Ndy Ekere, Jaepil Jung in Metals and Materials International (2013)

  3. No Access

    Chapter and Conference Paper

    Shear Strength and Fracture Surface Studies of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging Under Isothermal Ageing

    Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with t...

    Sabuj Mallik, Ahmed Z. El Mehdawi in Transactions on Engineering Technologies (2014)

  4. No Access

    Chapter and Conference Paper

    A Study of the Reliability of Electronic Telecommunication Systems Working at Subsea Level

    Reliability is of increasing importance for electronics systems operating at harsh environments, such as the electronic telecommunication systems used at subsea level. The aim of this research was to investiga...

    Sabuj Mallik, Franziska Kaiser in Transactions on Engineering Technologies (2015)

  5. No Access

    Article

    A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints

    The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. T...

    Jyotishman Nath, Sabuj Mallik, Anil Borah in Journal of The Institution of Engineers (I… (2015)

  6. Article

    Open Access

    Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)

    Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints cha...

    Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu in Journal of Electronic Materials (2021)

    Download PDF (3435 KB)

  7. No Access

    Article

    Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors

    The integrity of solder joints of components in an electronic device is critical to the device reliability. The miniaturisation trend in the development of electronic products has continued to challenge the s...

    Jude E. Njoku, Emeka H. Amalu, Ndy Ekere, Sabuj Mallik… in Journal of Electronic Materials (2023)

  8. Article

    Open Access

    Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

    Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital ...

    Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu in Journal of Electronic Materials (2023)

    Download PDF (3961 KB) View Article