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  1. No Access

    Article

    Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bum** for Sub-100 μm size solder bumps

    Stencil printing for flip chip packaging using fine particle solder pastes is a low cost assembly solution with high throughput for fine pitch solder joint interconnects. The manufacturing challenges associate...

    Santosh Kumar, Sabuj Mallik, Ndy Ekere, Jaepil Jung in Metals and Materials International (2013)

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    Article

    Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder

    The issue of soft error in microelectronics packaging have necessitated the development of low alpha (LA) activity solders as, as solders are found to be major sources of radiation in electronic devices that c...

    Santosh Kumar, Dohyun Jung, JaePil Jung in Journal of Materials Science: Materials in… (2013)

  3. No Access

    Article

    New process of electroplate Sn bum** on TSV without a PR mould for 3D-chip stacking

    A new method of fabricating Sn bumps by electroplating without a PR (photoresist) mould on a Si die was investigated in terms of the bump growth and morphology for application to 3D-chip stacking. The omission...

    Jiheon Jun, Inrak Kim, Jaepil Jung, Y. Norman Zhou in Metals and Materials International (2011)