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Article
Open AccessCharacterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital ...
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Article
Open AccessEffective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints cha...