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Comparative study of the (Co/Mn/Ni)xSny intermetallic compounds as anode active materials for lithium-ion batteries
Tin-based materials have been considered as next-generation candidates to replace carbon as anode materials for lithium-ion batteries (LIBs) owing to...
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Experimental Study of the Ni-Se-Sn Phase Diagram Isothermal Sections at 800 K, 1000 K and 1100 K
Three isothermal sections of the Ni-Se-Sn ternary system were experimentally investigated at 800 K, 1000 K and 1100 K in whole composition range. One...
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Lowering thermal conductivity in thermoelectric Ti2−xNiCoSnSb half Heusler high entropy alloys
Ti 2− x NiCoSnSb ( x = 0.125, 0.250, 0.375, and 0.500) half Heusler (HH) high-entropy thermoelectric alloys were synthesized by the arc melting—ball...
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Study on Microstructure and Interfacial Properties of n-Type Segmented Skutterudite/Half-Heusler Thermoelectric Material by Low-Temperature Bonding
Skutterudite (SKD)/Ni-Sn/Half-Heusler (HH) sandwich joining piece was developed and applied to fabricate segmented SKD/HH thermoelectric joints. The...
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Efficient hydrothermal deoxygenation of methyl palmitate to diesel-like hydrocarbons on carbon encapsulated Ni−Sn intermetallic compounds with methanol as hydrogen donor
Porous carbon-encapsulated Ni and Ni–Sn intermetallic compound catalysts were prepared by the one-pot extended Stöber method followed by...
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Effect of Sn Content on the Pore Structures of Porous Ni-Sn Alloys Produced by Reactive Synthesis Sintering Method
The objective of this work is to prepare porous Ni-Sn alloys by low temperature activation reaction sintering method. The phase composition, volume...
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Al-induced electroless deposition and characterization of Ni–Sn film anode for Li-ion battery
Nickel–Tin (Ni–Sn) film was fabricated by aluminum (Al) induced electroless process on copper foils as a current collector. This film was synthesized...
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Clarification of Peritectic Reaction Between Diffusion and Heat Transfer Mechanisms in Sn-Ni Alloy Through Confocal Laser Scanning Microscopy
AbstractThe nucleation and intermittent growth of peritectic Ni 3 Sn 4 phase along the liquid/primary Ni 3 Sn 2 interface were observed through...
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Intermetallic compound transformation and mechanical strength of Ni–Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment
In this study, the transformation of the intermetallic phase and high-temperature durability of the 30Ni–70Sn (wt%) transient liquid phase...
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Effects of High-Density Current on the Reliability of Ni-Sn Solid–Liquid Interdiffusion Joints with Al Interlayer
Electric vehicles are becoming increasingly popular as environmentally friendly alternatives to conventional fossil fuel-based vehicles. The need to...
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Interfacial Reactions in Ni/Se-Sn, Ni/Se-Te, Ni/Sn-Te and Ni/Se-Sn-Te Couples
SnSe-, SnTe- and Se - Sn - Te-based alloys are important materials for thermoelectric and optical recording applications and Ni is highly recommended as...
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New Nucleation Mechanism of the Liquid Droplet at the Solid–Solid Interface During Initial Thermal Stabilization Stage of Directional Solidification
AbstractDifferent from the previous report that liquid droplets nucleated within the superheated solid phases during thermal stabilization, the...
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Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
In recent years Au-Sn solid–liquid interdiffusion (SLID) has become a widely known bonding method to deliver promising die attaching techniques for...
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Formation and Physicochemical Properties of Composite Electrochemical Coatings of Tin–Nickel Alloy with Silicon Dioxide Incapsulated by Nanosized Titanium Dioxide
AbstractThe “SiO 2 core–TiO 2 shell” composite particles are synthesized and their properties are studied. Using the method of X-ray diffraction...
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Feasibility of Develo** a Heusler NiMnSn Alloy via Induction Casting Without Controlled Atmosphere
AbstractWe report a systematic investigation of the structural, thermal, and magnetic properties of Ni 50 Mn 37 Sn 13 Heusler alloy obtained by fusion without...
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Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys
The potential of Sn-Bi alloys as low-temperature solders for electronics manufacturing has spurred significant research on their mechanical...
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In Situ Observation and Growth Kinetics of Primary and Eutectic Structures in a Hypereutectic Cu–Ti Alloy
A typical hypereutectic Cu–Ti alloy has been prepared via the liquid-solid reaction approach. It is revealed that the ensuing bulky Cu–61 at. pct Ti...
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Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles
The concept of nanocomposite lead-free solders has provided a promising approach to improve mechanical reliability of solder joints. Minor additions...
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Increasing shear strength of Au–Sn bonded joint through nano-grained interfacial reaction products
Intermetallic compounds (IMCs) form at the solder/substrate interface during soldering, providing metallurgical bonding. However, cracks tend to...
