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Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints
The effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints was...
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Green and cost-effective synthesis of NiSn alloys by using intermittent microwave heating process as electrocatalysts for ethanol oxidation in alkaline solution
This work is focused on the design and development of carbon-supported NiSn alloys by using the intermittent microwave heating polyol process. The...
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Densification, Microstructure Evolution, and Mechanical Properties of Low-Temperature-Sintered 90W-4.9Ni-2.1Fe-3Cu Alloy
In this work, a 90W-4.9Ni-2.1Fe-3Cu alloy was developed for low-temperature sintering. Conventional 90W-7Ni-3Fe alloy, which is typically...
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Enhanced electromagnetic wave absorption property of binary ZnO/NiCo2O4 composites
Nowadays, metal oxide-based electromagnetic wave absorbing materials have aroused widely attentions in the application of telecommunication and...
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Advances in microwave absorbing materials with broad-bandwidth response
Microwave absorbing materials (MAMs) are playing an increasingly essential role in the development of wireless communications, high-power electronic...
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High-entropy spinel ferrites MFe2O4 (M = Mg, Mn, Fe, Co, Ni, Cu, Zn) with tunable electromagnetic properties and strong microwave absorption
Ferrites are the most widely used microwave absorbing materials to deal with the threat of electromagnetic (EM) pollution. However, the lack of...
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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish
The development of ball grid array (BGA) packages, such as the chip scale package, wafer level package and package on package, has focused on...
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Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
High entropy alloy (HEA) receives noticeable attention in the electronic industry, and one of the best ways to incorporate HEA with the existing...
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Three-dimensional macroscopic absorbents: From synergistic effects to advanced multifunctionalities
The accelerated arriving of 5G era has brought a new round of intelligent transformation which will completely emancipate smart terminal devices....
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Microstructural Evolution of Ni-Sn Transient Liquid Phase Sintering Bond during High-Temperature Aging
For high-temperature-resistant packaging of new generation power chip, a chip packaging simulation structure of Ni/Ni-Sn/Ni was bonded by a transient...
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Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint
Ag sinter joining provides superior mechanical and thermal/electrical properties and is considered to become a leading next-generation wide band-gap...
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Research on Interfacial Reaction and Growth Behavior of Intermetallic Compound of Dip-Soldered Sn/Ni System
Interfacial reaction and the growth behavior of intermetallic compound (IMC) between Sn solder and Ni substrate by dip soldering under different...
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The art of framework construction: hollow-structured materials toward high-efficiency electromagnetic wave absorption
The booming electronic technology is a pair blades sword, it has not only brought huge convenience but also the unprecedented challenges to human...
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Enhancing the Thermoelectric Performance of Self-Defect TiNiSn: A First-Principles Calculation
Carrier concentration is an important parameter for improving the thermoelectric (TE) properties of half-Heusler alloys, which can be achieved by...
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Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for...
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Effects of γ-ray irradiation on microstructure and mechanical property of AuSn20 solder joint
In this study, MoCu20/Cu joints via eutectic bonding recipe with AuSn20 solder were obtained to investigate the effect of γ-ray irradiation on the...
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Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates
Mechanical reliability of transient liquid phase (TLP) bonded Au–Sn/Ni(Cu) joints was investigated in this study. The results show that the TLP...
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Reaction of Ni-Based Superalloy with Liquid Sn During Liquid-Metal-Cooled Directional Solidification
The liquid metal cooling (LMC) process has attracted increasing attention in the investment casting industry in recent years. Liquid Sn is generally...
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Processing and Thermoelectric Properties of TiNiSn Materials: A Review
The half-Heusler alloy TiNiSn is a promising material for high-temperature thermoelectric applications due to its good thermal stability and...
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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders
This study investigates the effect of minor additions of Ni, Ni 3 Sn or Ni 3 Sn 2 nanoparticles on the microstructure and mechanical properties of...