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Article
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
Hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding with different bonding temperature are analyzed in this work. The investigation consists of two parts: hermetic seal stud...
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Article
Cu–Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation
Low-temperature Cu–Cu thermocompression bonding enabled by self-assembled monolayer (SAM) passivation for hermetic sealing application is investigated in this work. Cavities are etched to a volume of 1.4 × 10−3 c...
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Article
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration
Electroplated copper (Cu) films are often annealed during back-end processes to stabilize grain growth in order to improve their electrical properties. The effect of prebonding anneal and hence the effective i...
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Article
The axisymmetric boundary layer beneath a Rankine-like vortex
An experimental investigation of the three-dimensional boundary layer induced by a Rankine-like vortex with its axis normal to a stationary disk is described. The velocity field through the boundary layer was...