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  1. No Access

    Article

    Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

    Hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding with different bonding temperature are analyzed in this work. The investigation consists of two parts: hermetic seal stud...

    J. Fan, D. F. Lim, L. Peng, K. H. Li, C. S. Tan in Microsystem Technologies (2013)

  2. No Access

    Article

    Cu–Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation

    Low-temperature Cu–Cu thermocompression bonding enabled by self-assembled monolayer (SAM) passivation for hermetic sealing application is investigated in this work. Cavities are etched to a volume of 1.4 × 10−3 c...

    D. F. Lim, J. Fan, L. Peng, K. C. Leong, C. S. Tan in Journal of Electronic Materials (2013)

  3. No Access

    Article

    Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration

    Electroplated copper (Cu) films are often annealed during back-end processes to stabilize grain growth in order to improve their electrical properties. The effect of prebonding anneal and hence the effective i...

    L. Peng, D.F. Lim, L. Zhang, H.Y. Li, C.S. Tan in Journal of Electronic Materials (2012)

  4. No Access

    Article

    The axisymmetric boundary layer beneath a Rankine-like vortex

     An experimental investigation of the three-dimensional boundary layer induced by a Rankine-like vortex with its axis normal to a stationary disk is described. The velocity field through the boundary layer was...

    B. C. Khoo, K. S. Yeo, D. F. Lim in Experiments in Fluids (1997)