Abstract
Probable mechanisms for low-temperature insertion bonding were discussed.
Graphical abstract
Similar content being viewed by others
Availability of data and material
We ensured that all data and materials support their published claims and comply with field standards.
References
Sun, L., Chen, M.-h., Zhang, L., He, P., **e, L.-s.: Recent progress in SLID bonding in novel 3D-IC technologies. Journal of Alloys and Compounds 818 (2020). doi:https://doi.org/10.1016/j.jallcom.2019.152825
Gu, T., Cheng, P., Wang, S., Wang, H., Dai, X., Wang, H., Ding, G.: Mechanical property evaluation of TSV-Cu micropillar by compression method. Electron. Mater. Lett. 10(4), 851–855 (2014). https://doi.org/10.1007/s13391-014-3286-4
Ren, S., Sun, M., **, Z., Guo, Y., Ling, H., Hu, A.-M., Li, M.: Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps. Electron. Mater. Lett. 15(5), 562–571 (2019). https://doi.org/10.1007/s13391-019-00154-7
Sharma, A., Jung, D.-H., Roh, M.-H., Jung, J.P.: Fabrication and shear strength analysis of Sn-3.5Ag/Cu-filled TSV for 3D microelectronic packaging. Electron. Mater. Lett. 12(6), 856–863 (2016). https://doi.org/10.1007/s13391-016-6144-8
Chen, K.N., Fan, A., Tan, C.S., Reif, R., Wen, C.Y.: Microstructure evolution and abnormal grain growth during copper wafer bonding. Appl. Phys. Lett. 81(20), 3774–3776 (2002). https://doi.org/10.1063/1.1521240
Tofteberg, H.R., Schjølberg-Henriksen, K., Fasting, E.J., Moen, A.S., Taklo, M.M.V., Poppe, E.U., Simensen, C.J.: Wafer-level Au–Au bonding in the 350–450 °C temperature range. Journal of Micromechanics and Microengineering. 24(8) (2014). doi:https://doi.org/10.1088/0960-1317/24/8/084002
Lee, Y.-K., Ko, Y.-H., Kim, J.-K., Lee, C.-W., Yoo, S.: The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder. Electron. Mater. Lett. 9(1), 31–39 (2013). https://doi.org/10.1007/s13391-012-2128-5
Zhang, W., Ruythooren, W.: Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking. J. Electron. Mater. 37(8), 1095–1101 (2008). https://doi.org/10.1007/s11664-008-0487-3
Tu, K.N., Zeng, K.: Tin–lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R. Rep. 34(1), 1–58 (2001). https://doi.org/10.1016/S0927-796X(01)00029-8
Park, M.S., Gibbons, S.L., Arróyave, R.: Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions. Acta Mater. 60(18), 6278–6287 (2012). https://doi.org/10.1016/j.actamat.2012.07.063
Sohn, S., Moon, B., Lee, J., Kang, N., Moon, Y.: Interlayer Material Design Reducing Transient Liquid Phase Bonding Time. Electron. Mater. Lett. 16(2), 106–114 (2019). https://doi.org/10.1007/s13391-019-00191-2
Tan, C.S., Lim, D.F., Ang, X.F., Wei, J., Leong, K.C.: Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. Microelectron. Reliab. 52(2), 321–324 (2012). https://doi.org/10.1016/j.microrel.2011.04.003
Panigrahy, A.K., Chen, K.-N.: Low temperature Cu–Cu bonding technology in three-dimensional integration: an extensive review. Journal of Electronic Packaging. 140(1) (2018). doi:https://doi.org/10.1115/1.4038392
Chason, E., Jadhav, N., Chan, W.L., Reinbold, L., Kumar, K.S.: Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution and plastic deformation processes. Appl. Phys. Lett. 92(17) (2008). doi:https://doi.org/10.1063/1.2912528
Hosseinzaei, B., Kiani Rashid, A.R.: Transient liquid phase bonding in the Cu-Sn system. Soldering & Surface Mount Technology 31(4), 221–226 (2019). https://doi.org/10.1108/ssmt-09-2018-0031
Luu, T.-T., Duan, A., Aasmundtveit, K.E., Hoivik, N.: Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization. J. Electron. Mater. 42(12), 3582–3592 (2013). https://doi.org/10.1007/s11664-013-2711-z
Kannojia, H.K., Dixit, P.: Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks. Materials Letters. 257 (2019). doi:https://doi.org/10.1016/j.matlet.2019.126710
Chu, K., Sohn, Y., Moon, C.: A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scripta Mater. 109, 113–117 (2015). https://doi.org/10.1016/j.scriptamat.2015.07.032
Wu, D., Tian, W., Wang, C., Huo, R., Wang, Y.: Research of Wafer Level Bonding Process Based on Cu-Sn Eutectic. Micromachines (Basel) 11(9) (2020). doi:https://doi.org/10.3390/mi11090789
Cai, J., Wang, J., Wang, Q.: Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration. Microelectronic Engineering. 236 (2021). doi:https://doi.org/10.1016/j.mee.2020.111479
Zhang, W.: Fine pitch Cu/Sn solid state diffusion bonding for advanced three-dimensional chip stacking. Japanese Journal of Applied Physics. 54(3) (2015). doi:https://doi.org/10.7567/jjap.54.030203
Wang, J., Wang, Q., Liu, Z., Wu, Z., Cai, J., Wang, D.: Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection. Appl. Surf. Sci. 384, 200–206 (2016). https://doi.org/10.1016/j.apsusc.2016.05.023
Wang, J., Wang, Q., Wu, Z., Tan, L., Cai, J., Wang, D.: Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu–Sn bonding in 3D integration. Appl. Surf. Sci. 403, 525–530 (2017). https://doi.org/10.1016/j.apsusc.2017.01.207
Koyama, S., Aoki, Y., Shohji, I.: Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper. Mater. Trans. 51(10), 1759–1763 (2010). https://doi.org/10.2320/matertrans.MJ201019
Lu, Q., Chen, Z., Zhang, W., Hu, A., Li, M.: Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones. Appl. Surf. Sci. 268, 368–372 (2013). https://doi.org/10.1016/j.apsusc.2012.12.102
Bulasara, V.K., Thakuria, H., Uppaluri, R., Purkait, M.K.: Combinatorial performance characteristics of agitated nickel hypophosphite electroless plating baths. J. Mater. Process. Technol. 211(9), 1488–1499 (2011). https://doi.org/10.1016/j.jmatprotec.2011.03.022
Bulasara, V.K., Chandrashekar, O., Uppaluri, R.: Effect of surface roughness and mass transfer enhancement on the performance characteristics of nickel-hypophosphite electroless plating baths for metal–ceramic composite membrane fabrication. Chem. Eng. Res. Des. 89(11), 2485–2494 (2011). https://doi.org/10.1016/j.cherd.2011.04.007
Kumar, A., Kumar Suhag, A., Singh, A., Sharma, S.K., Kumar, M., Kumar, D.: Deposition and characterization of amorphous electroless Ni-Co-P alloy thin film for ULSI application. Materials Research Express. 1(3) (2014). doi:https://doi.org/10.1088/2053-1591/1/3/035007
Martins, J.I., Nunes, M.C.: On the kinetics of copper electroless plating with hypophosphite reductant. Surf. Eng. 32(5), 363–371 (2016). https://doi.org/10.1179/1743294415y.0000000066
Biswas, A., Das, S.K., Sahoo, P.: Hardness, Friction and Wear Trends of Electroless Ni-W-P Coating Heat-Treated at Different Temperatures. In: Advances in Materials, Mechanical and Industrial Engineering. Lecture Notes on Multidisciplinary Industrial Engineering, pp. 83–105. (2019). doi: https://doi.org/10.1007/978-3-319-96968-8_5
Buchtík, M., Doskočil, L., Brescher, R., Doležal, P., Másilko, J., Wasserbauer, J.: The Effect of Crystallization and Phase Transformation on the Mechanical and Electrochemical Corrosion Properties of Ni-P Coatings. Coatings. 11(4) (2021). doi:https://doi.org/10.3390/coatings11040447
Keong, K.G., Sha, W., Malinov, S.: Hardness evolution of electroless nickel–phosphorus deposits with thermal processing. Surf. Coat. Technol. 168(2–3), 263–274 (2003). https://doi.org/10.1016/s0257-8972(03)00209-3
Hou, L., Bi, S., Zhao, H., Xu, Y., Mu, Y., Lu, Y.: Electroless plating Cu-Co-P polyalloy on UV/ozonolysis irradiated polyethylene terephthalate film and its corrosion resistance. Appl. Surf. Sci. 403, 248–259 (2017). https://doi.org/10.1016/j.apsusc.2017.01.182
Tseng, C.H., Tu, K.N., Chen, C.: Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding. Sci Rep 8(1), 10671 (2018). https://doi.org/10.1038/s41598-018-28812-0
Lotfian, S., Molina-Aldareguia, J.M., Yazzie, K.E., Llorca, J., Chawla, N.: Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation. J. Electron. Mater. 42(6), 1085–1091 (2013). https://doi.org/10.1007/s11664-013-2517-z
Hu, F., Yang, S., Wang, H., Hu, A., Li, M.: Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding. J. Electron. Mater. 44(11), 4516–4524 (2015). https://doi.org/10.1007/s11664-015-3930-2
Wang, H., Leong, W.S., Hu, F., Ju, L., Su, C., Guo, Y., Li, J., Li, M., Hu, A., Kong, J.: Low-Temperature Copper Bonding Strategy with Graphene Interlayer. ACS Nano 12(3), 2395–2402 (2018). https://doi.org/10.1021/acsnano.7b07739
Ju, L., Sun, M., Ye, L., Zhang, L., Hu, A., Li, M.: Effects of reduced graphene oxide film on bonding interfaces between Cu microcones and 25 μm Sn/Cu bumps. J. Mater. Sci.: Mater. Electron. 28(22), 17370–17377 (2017). https://doi.org/10.1007/s10854-017-7670-3
Nguyen, Y.N., Kim, S., Bae, S.H., Son, I.: Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium and immersion gold surface modification. Applied Surface Science. 545 (2021). doi:https://doi.org/10.1016/j.apsusc.2021.149005
Hu, F., Wang, H., Yang, S., Hu, A., Li, M.: Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces. Appl. Surf. Sci. 353, 774–780 (2015). https://doi.org/10.1016/j.apsusc.2015.06.195
Qin, L., Zhuo, C., Liming, G., Ming, L.: Low-temperature bonding method based on metallic microcone array for interconnection application. In: 2012 14th International Conference on Electronic Materials and Packaging (EMAP), 13–16 Dec. 2012 2012, pp. 1–4. doi:https://doi.org/10.1109/EMAP.2012.6507901
Xu, P., Hu, F., Shang, J., Hu, A., Li, M.: An ambient temperature ultrasonic bonding technology based on Cu micro-cone array for 3D packaging. Mater. Lett. 176, 155–158 (2016). https://doi.org/10.1016/j.matlet.2016.04.109
Chen, Z., Cai, M., Liu, Z., Chen, Y., Yi, X., Wang, F., Zhu, W.: Amorphization and intermetallic nucleation in early-stage interfacial diffusion during Sn-solder/Ni solid-state bonding. J. Alloy. Compd. 859, 158399 (2021). https://doi.org/10.1016/j.jallcom.2020.158399
Deng, X., Chawla, N., Chawla, K.K., Koopman, M.: Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation. Acta Mater. 52(14), 4291–4303 (2004). https://doi.org/10.1016/j.actamat.2004.05.046
Huang, Y., Hang, T., Hu, A., Chen, Z., Lu, Q., Li, M.: Solid state diffusion between Sn and Cu microcones on Cu microcones. J. Alloy. Compd. 582, 408–413 (2014). https://doi.org/10.1016/j.jallcom.2013.08.076
Acknowledgements
This work was sponsored by the National Natural Science Foundation of China (61376107, 62004124) and the National Basic Research Program of China (973 Program, 2015CB057200). We also thank the Instrumental Analysis Center of Shanghai Jiao Tong University for the use of the SEM equipment.
Author information
Authors and Affiliations
Contributions
Yaqian Sun: Writing—original draft, Data curation, Validation, Investigation, Visualization. **g Wang: Methodology, Writing—review & editing, Formal analysis. Xundi Zhang: Writing—review & editing, Formal analysis. Chenlin Yang: Formal analysis. Anmin Hu: Conceptualization, Supervision. Tao Hang: Writing—review & editing. Yunwen Wu: Writing—review & editing. Huiqin Ling: Writing—review & editing. Ming Li: Project administration.
Corresponding author
Ethics declarations
Conflicts of interest
No conflict of interest and competing interests.
Ethical approval
We ensured that all authors obey the following guidelines and respect third parties’ rights such as copyright and/or moral rights.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Sun, Y., Wang, J., Zhang, X. et al. Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology. Electron. Mater. Lett. 17, 459–470 (2021). https://doi.org/10.1007/s13391-021-00302-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s13391-021-00302-y