Abstract
A micro-compression test method was presented to evaluate the mechanical property of the TSV-Cu micropillar in this paper. Firstly, the test sample containing TSV-Cu micropillar was prepared by MEMS micromachining technology. Then, the mechanical property of TSV-Cu micropillar was measured by a self-made micro-compression system. Finally, the effect of thermal treatment on the mechanical property of TSV-Cu micropillar was studied. The experimental results showed that the average yield strength (σ 0.2) of the TSV-Cu micropillar was 167 MPa. But it decreased to 137 MPa after being thermally treated at 400°C for 1 hour, which was probably due to the increased grain size of Cu.
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Gu, T., Cheng, P., Wang, S. et al. Mechanical property evaluation of TSV-Cu micropillar by compression method. Electron. Mater. Lett. 10, 851–855 (2014). https://doi.org/10.1007/s13391-014-3286-4
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DOI: https://doi.org/10.1007/s13391-014-3286-4