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    Preparation of a Li7La3Zr1.5Nb0.5O12 Garnet Solid Electrolyte Ceramic by using Sol-gel Powder Synthesis and Hot Pressing and Its Characterization

    In this study, we prepared and characterized Nb-doped Li7La3Zr2−xO12 (LLZNO) powder and pellets with a cubic garnet structure by using a modified sol-gel synthesis and hot pressing. LLZNO powder with a very small...

    Hee Chul Lee, Nu Ri Oh, Ae Ri Yoo, Yunsung Kim in Journal of the Korean Physical Society (2018)

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    Improving Li-ion battery charge rate acceptance through highly ordered hierarchical electrode design

    In Li-ion technology, increasing electrode loading (thickness) is one approach to improve performance; however, this approach typically compromises power density and safety. To achieve the goal of decoupling e...

    Yunsung Kim, Andy Drews, Rajeswari Chandrasekaran, Ted Miller, Jeff Sakamoto in Ionics (2018)

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    Protective enamel coating for n- and p-type skutterudite thermoelectric materials

    Transitioning skutterudite (SKD) thermoelectric technology from space to terrestrial power generation requires oxidation suppression technology. One approach involves the development of protective coatings con...

    Young-Sam Park, Travis Thompson, Yunsung Kim in Journal of Materials Science (2015)

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    Fracture behavior of Cu-cored solder joints

    Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions...

    Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin in Journal of Materials Science (2011)

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    Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

    Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones an...

    Taehoon You, Yunsung Kim, **a Kim, Jaehong Lee in Journal of Electronic Materials (2009)