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Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

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Abstract

Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The method involves evaluating the elastic strain energy and relating it to the impact resistance of the solder joint by considering the Young’s modulus of the bulk solder and the fracture stress of the solder joint during a ball pull test at high strain rates. The results show that solder joints can be ranked in order of descending elastic strain energy as follows: Sn-37Pb, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu, and Sn-4Ag-0.5Cu. This order is consistent with the actual drop performances of the samples.

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Authors and Affiliations

  1. School of Advanced Materials Engineering, Kookmin University, Chungneung-dong, Songbuk-ku, Seoul, 136-702, South Korea

    Taehoon You, Yunsung Kim, **a Kim & Heeman Choe

  2. MK Electron Co., Ltd., 316-2 Geumeoh-ri, Pogok-eup, Cheoin-gu, Yongin-si, Kyeonggi Province, 449-812, South Korea

    Jaehong Lee, Byungwook Jung & Jungtak Moon

Authors
  1. Taehoon You
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  2. Yunsung Kim
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  3. **a Kim
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  4. Jaehong Lee
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  5. Byungwook Jung
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  6. Jungtak Moon
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  7. Heeman Choe
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Correspondence to Heeman Choe.

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You, T., Kim, Y., Kim, J. et al. Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests. J. Electron. Mater. 38, 410–414 (2009). https://doi.org/10.1007/s11664-008-0633-y

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  • DOI: https://doi.org/10.1007/s11664-008-0633-y

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