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  1. No Access

    Article

    Thermal Cycling Study of Electrodeposited Sn–Ni and In–Ni Alloys

    We report the electrochemical deposition of Sn–Ni and In–Ni alloys containing 20 and 45 wt % of the lower melting point component. The percentage of nickel in the deposited alloys has been determined by gravim...

    V. M. Roshchin, I. N. Petukhov, A. S. Gak, M. S. Mikhailova… in Inorganic Materials (2020)

  2. No Access

    Article

    Formation of Two-Component Vertical Contact Structures for Mounting Integrated-Circuit Chips

    The technological capabilities of the layer-by-layer electrochemical formation of vertical contact structures based on a copper–tin system for mounting silicon chips, including 3D technologies, have been consi...

    V. M. Roshchin, I. N. Petukhov, K. S. Sen’chenko… in Russian Microelectronics (2017)

  3. No Access

    Article

    Electrochemical deposition of Ag–Sn alloys onto copper and titanium plates

    In this paper, we report a detailed study of the thermal properties of a peritectic Ag–Sn alloy electrochemically deposited onto copper and titanium plates in order to produce soldered contact structures. A co...

    M. S. Mikhailova, V. M. Roshchin, Yu. I. Shilyaeva, I. N. Petukhov… in Inorganic Materials (2016)

  4. No Access

    Article

    Physicochemical deposition features of peritectic alloys for high-density chip** of silicon crystals

    Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn–Ag peritectic composition for chip** integrated microcircuits by the inverted crystal method are considered. ...

    V. M. Roshchin, V. L. Dshkhunyan, I. N. Petukhov… in Russian Microelectronics (2016)

  5. No Access

    Article

    Electrochemical deposition of contact structures for integrated circuit packaging

    This paper considers electrochemical tin deposition for producing contact elements in integrated circuit packaging. We examine the effect of organic additives to sulfate electrolytes on the growth of local ver...

    V. M. Roshchin, V. L. Dshkhunyan, I. N. Petukhov, K. S. Sen’chenko… in Inorganic Materials (2015)

  6. No Access

    Article

    Effect of bottom-electrode morphology on the dielectric characteristics of the metal-ferroelectric-metal planar structure

    The effect of the morphology of metal-ferroelectric-metal interfaces on their electrical properties is studied. The effect of buffer layers and methods for depositing electrodes on ferroelectric-film morpholog...

    V. M. Roshchin, M. V. Silibin, V. B. Yakovlev, E. N. Yakovleva in Semiconductors (2014)

  7. No Access

    Article

    Synthesis and studies of local of ferroelectric properties of lead zirconate titanate thin films obtained by sol-gel technique

    Morphology of the surface and local ferroelectric properties of thin lead zirconate titanate (PZT) films synthesized by the sol-gel technique are studied by scanning probe microscopy. It is shown that the surf...

    D. A. Kiselev, M. V. Silibin, A. A. Dronov… in Inorganic Materials: Applied Research (2013)

  8. No Access

    Article

    Simulation and calculation of the piezoelectric modulus of a lead zirconate-titanate thin film in a test microstructure

    Results of simulation of stresses in the test structure of a silicon beam and analytical calculation of piezoelectric modulus d 31 of a lead zirconate-titanate (PZT) thin film arranged in ...

    V. V. Amelichev, D. A. Saikin, V. M. Roshchin, M. V. Silibin in Semiconductors (2010)

  9. No Access

    Article

    Study of properties of nanoscale lead zirconate titanate films

    Characteristics of lead zirconate titanate (PZT) alloy films 50–200 nm thick grown on sapphire and silicon substrates by low-temperature synthesis from Ti52Zr48 alloy films were studied. The surface morphology an...

    V. M. Roshchin, V. B. Yakovlev, M. V. Silibin, M. S. Lovyagina in Semiconductors (2008)