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Article
Open AccessCharacterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital ...
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Article
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors
The integrity of solder joints of components in an electronic device is critical to the device reliability. The miniaturisation trend in the development of electronic products has continued to challenge the s...
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Article
Open AccessEffective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints cha...
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Article
Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bum** for Sub-100 μm size solder bumps
Stencil printing for flip chip packaging using fine particle solder pastes is a low cost assembly solution with high throughput for fine pitch solder joint interconnects. The manufacturing challenges associate...
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Article
Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications
Sn-Ag-Cu solder pastes are widely used as the joining material in the electronic assembly process. The aim of this work was to evaluate the nonlinear viscoelastic behaviors of three different Sn-Ag-Cu solder p...