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Open AccessLocation-Specific Microstructure Characterization Within AM Bench 2022 Laser Tracks on Bare Nickel Alloy 718 Plates
Additive manufacturing of metal alloys produces microstructures that are typically very different from those produced by more traditional manufacturing approaches. Computer simulations are useful for connectin...
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Article
Location-Specific Microstructure Characterization Within IN625 Additive Manufacturing Benchmark Test Artifacts
Additive manufacturing (AM) of alloys creates segregated microstructures with significant differences from those of traditional wrought alloys. Understanding how the local build conditions generate specific mi...
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Article
Solidification of Ni-Re Peritectic Alloys
Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44 mass fraction Re provide information to resolve diffe...
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Article
The Influence of Annealing Temperature and Time on the Formation of δ-Phase in Additively-Manufactured Inconel 625
This research evaluated the kinetics of δ-phase growth in laser powder bed additively-manufactured (AM) Inconel 625 during post-build stress-relief heat treatments. The temperatures ranged between 650 °C and 1050...
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Article
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...
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Article
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...
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Article
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...
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Article
Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4
Electron backscattered diffraction (EBSD) and energy dispersive X-ray spectroscopy (EDS) have been performed on a plate-shaped phase formed through the reaction of Sn and Ni. The phase is formed during extende...
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Article
Moving the pulsed heating technique beyond monolithic specimens: Experiments with coated wires
Pulsed heating experiments that measure high-temperature thermophysical properties using pyrometric measurement of the temperature–time history of metal specimens rapidly heated by passage of electric current ...
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Article
Alpha case thickness modeling in investment castings
The alpha case thickness at the surface of a Ti-6Al-4V (wt pct) step wedge investment casting has been measured and successfully predicted. The prediction uses temperature-time results obtained from a heat flo...
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Article
Evolution of the two-phase microstructure L12 + DO22 in near-eutectoid Ni3(Al,V) alloy
Transmission electron microscopy and powder x-ray diffraction methods have been used to investigate the evolution of two-phase (L12 + DO22) microstructures from the quenched fcc phase of the Ni-5Al-20V (at. %) al...
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Article
Thermophysical properties of elastomers
The following account describes investigations of dimensional and stiffness characteristics of representative polyacrylic and silicone rubbers over the approximate temperature range 20 °C–175 °C. The results h...