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Article
Solidification of Ni-Re Peritectic Alloys
Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44 mass fraction Re provide information to resolve diffe...
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Article
Interdiffusion in the Ni-Re System: Evaluation of Uncertainties
Diffusion couple experiments between Ni and Re at 1200 and 1350 °C were performed. These experiments established the limits of the two-phase FCC + HCP region. No intermediate phase was observed at these temper...
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Article
Diffusion in FCC Co-rich Co-Al-W Alloys at 900 and 1000 °C
Diffusion couple experiments between various Co-rich face centered cubic (FCC) alloys in the Co-W-Al ternary system have been conducted at 900 and 1000 °C. Diffusion coefficients have been extracted for the Co...
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Article
Tailoring the topology of an artificial magnetic skyrmion
Despite theoretical predictions, it remains an experimental challenge to realize an artificial magnetic skyrmion whose topology can be well controlled and tailored so that its topological effect can be reveale...
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Article
Apparent treatment-resistant hypertension among elderly Korean hypertensives: an insight from the HIT registry
The aim of this study was to determine the clinical characteristics of patients with resistant hypertension (RH) and predictors among elderly Korean hypertensives. This prospective, multi-center, observational...
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Article
Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits
The effect of current density and Sn methane sulfonate concentration on hillock density, columnar grain size, crystallographic texture, and residual stress of bright Sn electrodeposits is measured. Correlation...
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Article
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...
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Article
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...
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Article
Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic
Determining an accurate eutectic composition is more difficult than determining the corresponding eutectic temperature, a fact that was demonstrated in this study using a lead-free solder: the tin-rich Sn-Ag-C...
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Article
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases is of critical interest. Phase...
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Article
Physico-Chemical Characterization of the Coprecipitated Y-Ba-Cu-O Fine Powders
Y-Ba-Cu-o fine powders were prepared by coprecipitating in the oxalate form from metal nitrates solution. The stoichiometry of metals in the precipitate was adjusted by systematic change of copper nitrate (or ...