SpringerLink
Log in

Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits

  • Original Paper
  • Published:
Journal of Applied Electrochemistry Aims and scope Submit manuscript

Abstract

The effect of current density and Sn methane sulfonate concentration on hillock density, columnar grain size, crystallographic texture, and residual stress of bright Sn electrodeposits is measured. Correlation was found between hillock density and the ratio of the applied current density to the transport limited current density. When the ratio exceeds unity no hillocks are observed. As the transport limited current is approached and exceeded, the columnar grain size decreases from 1.4 to 0.7 μm and the preferred orientation (fiber texture) rotates toward the [001] direction. Possible explanations are presented for how these factors reduce hillock growth. Because hillock and whisker growth are related phenomena, electrodeposition beyond the limiting current may be a possible whisker mitigation strategy.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16

We’re sorry, something doesn't seem to be working properly.

Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.

References

  1. Furuta N, Hamamura K (1969) Jpn J Appl Phys 8:1404

    Article  CAS  Google Scholar 

  2. http://nepp.nasa.gov/WHISKER/index.html. Accessed 23 June 2008

  3. Arnold SM (1966) Plating 53:96

    CAS  Google Scholar 

  4. Lee BZ, Lee DN (1998) Acta Mater 46:3701

    Article  CAS  Google Scholar 

  5. Tu KN (1973) Acta Metall 21:347

    Article  CAS  Google Scholar 

  6. Tu KN (1994) Phys Rev B-Condens Matter 49:2030

    CAS  Google Scholar 

  7. Chason E, Jadhav N, Chan WL, Reinbold L, Kumar KS (2008) Appl Phys Lett 92:171901

    Article  Google Scholar 

  8. Kumar KS, Reinbold L, Bower AF, Chason E (2008) J Mater Res 23:2916–2934

    Article  CAS  Google Scholar 

  9. Boettinger WJ, Johnson CE, Bendersky LA, Moon K-W, Williams ME, Stafford GR (2005) Acta Mater 53:5033–5050

    Article  CAS  Google Scholar 

  10. Barsoum MW, Hoffman EN, Doherty RD, Gupta S, Zavaliangos A (2004) Phys Rev Lett 93:206104

    Article  CAS  Google Scholar 

  11. Chadhari PJ (1974) Appl Phys 45:4339

    Article  Google Scholar 

  12. Jackson MS, Li C-Y (1982) Acta Metall 30:1993

    Article  CAS  Google Scholar 

  13. Doerner MF, Nix WD (1988) CRC Crit Rev Solid State Mater Sci 14:225

    Article  CAS  Google Scholar 

  14. Bard AJ, Faulkner LR (2001) Electrochemical methods: fundamentals and applications, 2nd edn. Wiley, NJ

    Google Scholar 

  15. Barrett CS, Massalski TB (1980) Structure of metals crystallographic methods, principles, and data, 3rd edn. Pergamon, New York, pp 204–205

    Google Scholar 

  16. Chen CS, Wan CC, Wang YY (1998) Trans Inst Met Finish 76:54–58

    CAS  Google Scholar 

  17. Paunovic Milan, Schlesinger Mordechay (1998) Fundamentals of electrochemical deposition. Wiley, New York

    Google Scholar 

  18. Fleischmann M, Thirsk HR (1963) In: Delahay P, Tobias CW (eds) Advances in electrochemistry and electrochemical engineering, vol 3. Interscience, New York

    Google Scholar 

  19. Budevski E, Bostanov V, Staikov G (1980) Ann Rev Mater Sci 10:85–112

    Article  CAS  Google Scholar 

  20. Milchev A (2002) Electrocrystallization, fundamentals of nucleation and growth. Springer, New York

    Google Scholar 

  21. Rashidi AM, Amadeh A (2008) Surf Coat Technol 202:3772

    Article  CAS  Google Scholar 

  22. Pinsky DA (2008) Microelectron Reliab 48:105–110

    Article  Google Scholar 

  23. Lal S, Moyer TD (2005) IEEE Trans Electron Packag Manuf 28:63–74

    Article  CAS  Google Scholar 

  24. Jiang B, **an A (2008) Microelectron Reliab 48:675–681

    Article  Google Scholar 

  25. Saito M, Sasaki H, Katou K, Toba T, Homma T (2009) J Electrochem Soc 156:E86–E90

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Metallurgy Division, National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD, 20899-8555, USA

    K.-W. Moon, M. E. Williams, W. J. Boettinger & G. R. Stafford

  2. Center for Fuel Cell Research, Korea Institute of Science and Technology, 39-1 Hawolgok-dong, Seongbuk-gu, Seoul, 136-791, South Korea

    S.-K. Kim

Authors
  1. K.-W. Moon
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S.-K. Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. M. E. Williams
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. W. J. Boettinger
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. G. R. Stafford
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to W. J. Boettinger.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Moon, KW., Kim, SK., Williams, M.E. et al. Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits. J Appl Electrochem 40, 1671–1681 (2010). https://doi.org/10.1007/s10800-010-0163-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10800-010-0163-1

Keywords

Search

Navigation