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  1. No Access

    Article

    Anode Design Based on Microscale Porous Scaffolds for Advanced Lithium Ion Batteries

    Considering the increasing demands for advanced power sources, present-day lithium-ion batteries (LIBs) must provide a higher energy and power density and better cycling stability than conventional LIBs. This ...

    Hyeji Park, Hyelim Choi, Kyungju Nam, Sukyung Lee… in Journal of Electronic Materials (2017)

  2. No Access

    Article

    Morphology and Gas-Sensing Properties of Tin Oxide Foams with Dual Pore Structure

    Tin oxide is a commonly used gas-sensing material, which can be applied as an n- or p-type gas sensor. To improve the gas-sensing performance of tin oxide, we successfully synthesized tin oxide foam via an ice-te...

    Kyungju Nam, Hyeong-Gwan Kim, Hyelim Choi, Hyeji Park… in Journal of Electronic Materials (2017)

  3. No Access

    Article

    Processing, Microstructure, and Oxidation Behavior of Iron Foams

    With its historically long popularity in major structural applications, the use of iron (Fe) has also recently begun to be explored as an advanced functional material. For this purpose, it is more advantageous...

    Hyeji Park, Yoonsook Noh, Hyelim Choi… in Metallurgical and Materials Transactions A (2016)

  4. No Access

    Article

    Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

    This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the sig...

    Hyelim Choi, Wayne D. Kaplan, Heeman Choe in Journal of Electronic Materials (2016)

  5. No Access

    Article

    Morphological Study of Directionally Freeze-Cast Nickel Foams

    Nickel foams, consisting of 51 to 62 pct aligned, elongated pores surrounded by a network of Ni walls, were fabricated by reduction and sintering of directionally cast suspensions of nanometric NiO powders in ...

    Hyungyung Jo, Min Jeong Kim, Hyelim Choi… in Metallurgical and Materials Transactions E (2016)

  6. No Access

    Article

    Fracture behavior of Cu-cored solder joints

    Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions...

    Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin… in Journal of Materials Science (2011)