Abstract
This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the significantly thicker intermetallic compound (IMC) formed at the solder joint, the 0.1 wt.% Y-doped joint exhibited a higher fracture strength than its baseline Sn-1.0Ag-0.5Cu counterpart under most aging and reflow conditions. This may be associated with the formation of Y-Cu IMCs formed at the interface between the solder and the Cu substrate, because the Y-Cu IMCs have recently been referred to as relatively ‘ductile’ IMCs.
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Choi, H., Kaplan, W.D. & Choe, H. Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints. J. Electron. Mater. 45, 3259–3262 (2016). https://doi.org/10.1007/s11664-016-4489-2
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DOI: https://doi.org/10.1007/s11664-016-4489-2