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    Article

    Mechanical behavior of Li-ion-conducting crystalline oxide-based solid electrolytes: a brief review

    Li-ion-conducting solid electrolytes are receiving considerable attention for use in advanced batteries. These electrolytes would enable use of a Li metal anode, allowing for batteries with higher energy densi...

    Jeff Wolfenstine, Jan L. Allen, Jeff Sakamoto, Donald J. Siegel, Heeman Choe in Ionics (2018)

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    Anode Design Based on Microscale Porous Scaffolds for Advanced Lithium Ion Batteries

    Considering the increasing demands for advanced power sources, present-day lithium-ion batteries (LIBs) must provide a higher energy and power density and better cycling stability than conventional LIBs. This ...

    Hyeji Park, Hyelim Choi, Kyungju Nam, Sukyung Lee in Journal of Electronic Materials (2017)

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    Article

    Morphology and Gas-Sensing Properties of Tin Oxide Foams with Dual Pore Structure

    Tin oxide is a commonly used gas-sensing material, which can be applied as an n- or p-type gas sensor. To improve the gas-sensing performance of tin oxide, we successfully synthesized tin oxide foam via an ice-te...

    Kyungju Nam, Hyeong-Gwan Kim, Hyelim Choi, Hyeji Park in Journal of Electronic Materials (2017)

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    Article

    Structural and electrical properties of Cr doped nickel ferrite

    The Chromium doped Nickel ferrite nanopowders prepared by sol–gel combustion route by nitrates of respective metal ions. Formation of structure, morphology has been confirmed by X-ray powder diffraction method...

    M. K. Shobana, Heeman Choe in Journal of Materials Science: Materials in Electronics (2016)

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    Article

    Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

    This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the sig...

    Hyelim Choi, Wayne D. Kaplan, Heeman Choe in Journal of Electronic Materials (2016)

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    Article

    Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

    Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones an...

    Taehoon You, Yunsung Kim, **a Kim, Jaehong Lee in Journal of Electronic Materials (2009)