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1. Recent advances on SnBi low-temperature solder for electronic interconnections

   SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point...

   Nan Jiang, Liang Zhang, ... Peng He in Journal of Materials Science: Materials in Electronics

   Article 26 August 2021
   

2. Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders

   In this paper, copper nanowires (Cu NWs) were mixed into the Sn1.0Ag0.5Cu solder to improve the properties of Sn1.0Ag0.5Cu solder and change the...

   Zhi-Hao Li, Liang Zhang, ... Lei Zhang in Journal of Materials Science: Materials in Electronics

   Article 02 March 2022
   

3. Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

   Sintering of Cu nanoparticles at low temperature is a promising material for advanced power electronic packaging; while its sintering quality is...

   Ze Cui, Qiang Jia, ... Fu Guo in Journal of Materials Science: Materials in Electronics

   Article 11 April 2024
   

4. Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu

   This study investigated the effects of Ga do** (0.1–1 wt.% Ga) on Sn-Ga/Cu interfacial reactions. In liquid-state reactions at 250°C, the addition...

   Chao-hong Wang, Kuan-ting Li, Yee-wen Yen in JOM

   Article 29 February 2024
   

5. Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging

   This study focuses on the process optimization of pressureless Cu sintering for semiconductor die attach application. The die attachment joints were...

   **gru Dai, Yangang Wang, ... Muhmmad Morshed in Journal of Electronic Materials

   Article 06 September 2023
   

6. Permeable, three-dimensional integrated electronic skins with stretchable hybrid liquid metal solders

   The development of wearable and on-skin electronics requires high-density stretchable electronic systems that can conform to soft tissue, operate...

   Qiuna Zhuang, Kuanming Yao, ... Zijian Zheng in Nature Electronics

   Article 01 July 2024
   

7. Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders

   This study investigated the interfacial reactions of Co with molten In and eutectic In–48at.%Sn solders at different temperatures. For the In/Co...

   Chao-hong Wang, Tai-Yu Chang in Journal of Materials Science: Materials in Electronics

   Article 22 April 2022
   

8. Low Temperature Soldering 6061 Aluminum Alloys by Using the Synthesized Sn9Zn Nano-Amorphous Particles

   Abstract

   To meet the growing demand of technologies of high performance electronics, nano-solders have been widely developed. In the present study,...

   Hao Hong, Ding Min in Metals and Materials International

   Article 13 November 2021
   

9. Effect of Ag₃Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature

   In situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10  μ m/s and 300  μ m/s at − 198 °C liquid nitrogen...

   **angxi Zhao, Wei Zhang, ... Yanhong Tian in Journal of Materials Engineering and Performance

   Article 31 July 2023
   

10. Application Study on Diversified Low-Temperature Soldering Technology of Antenna and Feed System for an Airborne Electronic Countermeasure Equipment

    The low-temperature soldering technology is promising permanent connection technique to realize the soldering of components, microstrip boards,...

    Guang-yue Xu, Wen-rong Li, ... **ao-han Zhang in Proceedings of the Eighth Asia International Symposium on Mechatronics

    Conference paper 2022
    

11. Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders

    In this paper, the oxidation resistance of SCN (Sn–0.7Cu–0.05Ni), SCP (Sn–0.7Cu doped by 0.02 wt% P), and SCNPG solder alloys (Sn–0.7Cu with 0.007...

    Chen Liu, Jubo Peng, ... **ao**g Wang in Journal of Materials Science: Materials in Electronics

    Article 07 January 2023
    

12. Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications

    An urgent demand for lowering bonding temperature has been put forward by advanced flip-chip integration such as micro-LED packaging and...

    Wen-Hui Zhu, **ao-Yu **ao, ... Gang-Long Li in Advances in Manufacturing

    Article 16 December 2022
    

13. Mechanisms of the Structure Formation of Soldered Seams When Using Composite Solders

    This study shows the results of experimental studies of the mechanism of formation of the structure of soldered joints during high-frequency heating...

    Vladimir Lebedev, Ivan Vegera, ... Ruslan Dzhemalyadinov in Advances in Design, Simulation and Manufacturing V

    Conference paper 2022
    

14. Effect of Al Addition on Electrochemical Behavior of Sn-0.7Cu-xAl Lead-Free Solders Alloys in 3.5 wt.% NaCl Solution

    The corrosion behavior of alloys is highly significant as far as lead-free solder applications are concerned. The corrosion performance of the alloy...

    Dheeraj Jaiswal, Dileep Pathote, ... C. K. Behera in Journal of Materials Engineering and Performance

    Article 18 March 2022
    

15. Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution

    Various electronic equipment has been exposed to a very harsh atmospheric condition that results in corrosion of the solders inside it. The type of...

    Dheeraj Jaiswal, Vikrant Singh, ... C. K. Behera in Journal of Materials Science: Materials in Electronics

    Article 21 August 2021
    

16. The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders

    Pb-free solders are gaining ground as the optimum choice for electrical interconnect materials, however, their higher melting temperature around 217...

    Mehdi Raza, Lee Shewchenko, ... Rezwanul Haque in Journal of Materials Science: Materials in Electronics

    Article 02 August 2021
    

17. Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)

    The purpose of this chapter is to provide an overview of current and future deployment of second level interconnect reliability on types of second...

    Chong Leong, Gan, Chen-Yu, Huang in Interconnect Reliability in Advanced Memory Device Packaging

    Chapter 2023
    

18. The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

    With low liquidus temperatures, low raw material costs, and non-toxicity, Sn-Bi low-temperature solders are promising candidates for the replacement...

    **n F. Tan, Qichao Hao, ... Kazuhiro Nogita in Journal of Electronic Materials

    Article 06 December 2023
    

19. Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics

    Low-temperature soldering technology (185–195 °C) is applied for assembling consumer electronics with various Bi contents, and board-level drop...

    J. Ren, M. L. Huang in Journal of Materials Science: Materials in Electronics

    Article 16 May 2021
    

20. Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components

    As a result of growing technological advancement, the increase in input and output terminals in electronic packaging has increased significantly....

    M. A. Azmah Hanim, T. T. Dele-Afolabi in Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

    Conference paper 2023