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Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components

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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium (EPITS 2022)

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 289))

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Abstract

As a result of growing technological advancement, the increase in input and output terminals in electronic packaging has increased significantly. This signifies the commensurate rise in the number of solder joint interconnections. Hence, for the purpose of complying with the mission and vision of the electronic industry including the manufacturing of robust, efficient, and miniaturized devices, it is essential to incorporate reinforcing components into the existing traditional lead-free solders for the requisite materials modification. This short review article documents the progress made so far in the improvement of lead-free solders with selected reinforcement. The article covers the evaluation of the reliability level of solders reinforced with three targeted categories of materials such as carbon-based nanomaterials, interlayer components, and agricultural waste.

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Acknowledgements

The authors would like to acknowledge that the study covered in this short review was funded by Universiti Putra Malaysia (UPM—Grant Putra; UPM/700-2/1/GPBI/2017/9553600) and (UPM/GP-IPB/2020/9688700).

Author information

Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. A. Azmah Hanim

  2. Advance Engineering Materials and Composites Research Center, (AEMC), Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. A. Azmah Hanim

  3. Department of Mechanical Engineering, Faculty of Engineering, Ajayi Crowther University, P.M.B. 1066, Oyo, Oyo State, Nigeria

    T. T. Dele-Afolabi

Authors
  1. M. A. Azmah Hanim
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  2. T. T. Dele-Afolabi
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Corresponding author

Correspondence to M. A. Azmah Hanim .

Editor information

Editors and Affiliations

  1. Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

    Mohd Arif Anuar Mohd Salleh

  2. Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

    Dewi Suriyani Che Halin

  3. Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

    Kamrosni Abdul Razak

  4. Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

    Mohd Izrul Izwan Ramli

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© 2023 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Azmah Hanim, M.A., Dele-Afolabi, T.T. (2023). Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components. In: Mohd Salleh, M.A.A., Che Halin, D.S., Abdul Razak, K., Ramli, M.I.I. (eds) Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium. EPITS 2022. Springer Proceedings in Physics, vol 289. Springer, Singapore. https://doi.org/10.1007/978-981-19-9267-4_19

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