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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding
Cu/In-48Sn- x CuZnAl/Cu ( x = 0, 0.1, 0.2, 0.4, 0.6 wt.%) solder joints were prepared by transient liquid phase (TLP) bonding. The microstructure and...
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Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid–liquid electromigration
The effects of the addition of Cu foam on the microstructure and mechanical properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints bonded with solid–liquid...
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Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process
Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...
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Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
This study was aimed at examining the applicability of Cu–Sn system transient liquid phase (TLP) bonding using Cu foam to high-temperature operating...
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Analysis of solder mask roughness and stencil shape influence on void formation in solder joints
Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article...
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Prediction of BGA solder joint array shape using improved Perzyna model and Anand model
The shape of solder joints formed during the soldering process has a significant impact on the reliability of electronic products. While various...
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Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization
To intuitively reveal the influences of original solder grain orientation on thermal fatigue damage mechanisms of the SnAgCu/Cu solder joints at...
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Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
There has been an increasing demand for more reliable high-temperature resistant solder joints in recent years. Develo** a reliable...
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Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint
This study investigates the effect of Ni additions of 0.05 and 0.1 wt% on the properties of SAC0307/Cu solder joints. The interfacial microstructure,...
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Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste
The main aim of this study is to determine the effect of dopant particles on the spreadability of composite solder paste during the reflow soldering...
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Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics
The microstructural evolution and failure mode of Sn–3.0Ag–0.5Cu (SAC305)/Sn–37Pb hybrid ball grid array solder joints with various mixed percentages...
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Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point
A high-Cu-content-mixed solder paste comprising Sn–3.0Ag–0.5Cu (SAC305) + 20 wt% Sn– x Cu ( x = 3, 5, 8, and 10) was prepared in this study. The melting...
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Boride Coatings on Steel Protecting it Against Corrosion by a Liquid Lead-Free Solder Alloy
The goal of this research is to study the applicability of the diffusion boriding process as a high-temperature thermochemical heat treatment to...
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Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
Wetting phenomena concerning Sn-Zn eutectic alloys with Ag addition were studied in contact with Cu substrate at 250 °C and in the presence of ALU33...
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Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder
Minor In (0, 0.5, 1, 2 wt%) was doped into the Sn–4Ag–0.5Cu–3Bi–0.05Ni (SACBN) solder to investigate the effects of In on the melting...
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Superplasticity Deformation of Sn-Bi-Based Solder Alloys
Low-temperature solderLow-temperature solder alloys have drawn a large amount of attention. Because using low-temperature soldering also reduces the...
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Effect of (111) oriented nanotwinned Cu substrate on the electromigration of Sn58Bi solder joint at high current density
(111) oriented nanotwinned copper ((111)nt-Cu) has attracted much attention and shown a good application prospect as Under Bump Metallurgy (UBM) in...
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Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions
This study examined the interface microstructure that developed between 63Sn-37Pb (Sn-Pb) solder and the Au protective layer that was not fully...
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Recent Progress in Lead-Free Solder Technology Materials Development, Processing and Performances
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances....
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Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy
In-48Sn eutectic solder is an ideal candidate for flexible electronics equipment packaging because of its low melting point (118 °C) and low...
