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Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics

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Abstract

The microstructural evolution and failure mode of Sn–3.0Ag–0.5Cu (SAC305)/Sn–37Pb hybrid ball grid array solder joints with various mixed percentages undergoing electromigration (EM) at 130 °C with a current density of 5 × 103 A/cm2 were investigated. The EM reliability of Ni/SAC305/Sn–37Pb/Ni hybrid solder joints increased with increasing mixed percentage. The hybrid solder joints with 25% mixed percentage had the worst EM reliability, showing cracks and occurrence of final failure at the cathode, since higher Pb content at the cathode decreased the melting point of solder while increased the local resistivity of solder and subsequently more Joule heat was generated to melt the local solder, and finally the hybrid solder joints failed in the liquid–solid EM failure mode. While for the hybrid solder joints with higher mixed percentages (50 and 100%), only a few voids occurred at the cathode. The growth rate of interfacial IMCs at the anode was the fastest for the hybrid solder joints with 100% mixed percentage, due to the lower diffusion activation energy of atoms; while at the cathode, the thickness of interfacial IMCs increased first and then decreased, due to the combined effect of chemical potential gradient-induced flux and EM-induced flux.

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Acknowledgements

This work was supported by the Science and Technology Plan of Liaoning Province [2022JH2/101300260] and the National Natural Science Foundation of China (Grant Nos. 52350321 and U1837208).

Funding

This work was supported by the Science and Technology Plan of Liaoning Province [2022JH2/101300260] and the National Natural Science Foundation of China (Grant Nos. 52350321 and U1837208).

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Authors and Affiliations

  1. Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian, 116024, China

    S. Q. Yin, J. Ren & M. L. Huang

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  1. S. Q. Yin
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  2. J. Ren
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  3. M. L. Huang
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All the authors contributed equally.

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Correspondence to M. L. Huang.

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Yin, S.Q., Ren, J. & Huang, M.L. Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics. J Mater Sci: Mater Electron 35, 838 (2024). https://doi.org/10.1007/s10854-024-12609-1

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