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Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

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Abstract

In-48Sn eutectic solder is an ideal candidate for flexible electronics equipment packaging because of its low melting point (118 °C) and low electrical resistivity (0.14 × 10–6 Ω·m), but its low tensile strength and solder joint shear strength give some cause for concern. In this paper, the microstructure, thermal physical and mechanical properties of Bismuth-doped In–Sn-based low temperature solder alloy were simulated by using JMatPro software, and the optimized alloy composition was In-45.6Sn-5Bi. The experimental results show that ‘In–Sn–Bi ternary eutectic reaction in In-45.6Sn–5Bi alloy leads to the formation of a certain amount of BiIn intermetallic compounds (IMCs) which significantly refines the grains of β and γ phases, thus improving the mechanical properties of the alloy. Through the synergistic effect of second phase strengthening and fine grain strengthening, the tensile strength of the alloy is improved to 23.1 MPa, Vickers hardness is improved to 6.2 HV0.2, and the shear strength of solder joint is improved to 5.8 MPa. Compared with the traditional experimental “trial and error” material development model, this paper provides a more efficient, low-cost and high-precision low-temperature solder development method, which provides a theoretical and experimental basis for develo** high-strength low-temperature solder.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

Code availability

Not applicable.

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Funding

This work was supported by National Key R&D Program of China (No. 2017YFB0310300), and National Natural Science Foundation of China and the China Academy of Engineering Physics (NSAF) (No. U1630137).

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Authors and Affiliations

  1. Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University, Shenyang, 110819, Liaoning, China

    Lingmin Ye, **aodong Li, Mu Zhang, Qi zhu & Xudong Sun

  2. School of Materials Science and Engineering, Northeastern University, Shenyang, 110819, Liaoning, China

    Lingmin Ye, **aodong Li, Mu Zhang, Qi zhu & Xudong Sun

  3. Foshan Graduate School of Northeastern University, Foshan, 528311, Guangdong, China

    Xudong Sun

Authors
  1. Lingmin Ye
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  2. **aodong Li
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  3. Mu Zhang
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  4. Qi zhu
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  5. Xudong Sun
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Contributions

All authors contributed to the study conception and design. Lingmin Ye: Conceptualization, Investigation, Formal analysis, Data curation, Writing-original draft. **aodong Li: Conceptualization, Resources, Writing-review & editing, Funding acquisition, Supervision. Mu Zhang: Writing-review, Editing. Qi Zhu: Formal analysis. Xudong Sun: Methodology, Supervision.

Corresponding author

Correspondence to **aodong Li.

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The authors declare no conflict of interest and have no known competing financial interest or personal relationships that could have appeared to influence the work reported in this paper. Manuscript is approved by all authors listed for publication.

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The authors followed the ethical standards during the experiments as well as for the preparation of the manuscript, and manuscript is approved by all the authors listed for publication.

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Ye, L., Li, X., Zhang, M. et al. Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy. J Mater Sci: Mater Electron 35, 1303 (2024). https://doi.org/10.1007/s10854-024-13000-w

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  • DOI: https://doi.org/10.1007/s10854-024-13000-w

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