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Design energy efficient shared distributed memory management system on SoC’s to improve memory performance
System-on-Chip (SoC) design is becoming increasingly complex as a result of trends such as miniaturisation and data-intensive applications, and it is...
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Device Architecture and Fabrication
This chapter begins with a section explaining market segmentation of today’s white LED products. For deeper understanding of LED devices and...
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Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges
A new technological approach is needed for the development of emerging electronic components and systems within the Internet of Things (IoT) era. New...
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Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies
Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly...
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Some Nanomaterials for Microelectronics and Photonics Packaging
This chapter addresses the state-of-art nanoscience and technologies related to the next-generation high-density microelectronics and bio-packaging...
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Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding
Hourglass-shaped microbump joints are expected to be used in three-dimensional (3D) chip stacking interconnect technology due to their strong...
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Improved Mounting of Strain Sensors by Reactive Bonding
Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a...
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Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
This paper provides an overview of technical enhancements of current encapsulant materials (epoxy molding compound and underfill) and future...
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The bottom of the memory hierarchy: Semiconductor and DNA data storage
Flash memory is distinct from other types of data storage––such as hard disk drives (HDDs) that are still in active use and floppy disks, CDs, and...
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Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting
In the application of high-performance three-dimensional integrated circuits (3D IC), due to the continuous decreasing trend of chip interconnection...
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Advancements in Back End of Line Technology: Enhancing Semiconductor Manufacturing Efficiency
This chapter explores the advancements in Back End of Line (BEOL) technology in semiconductor manufacturing. BEOL encompasses the crucial steps in...
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Device Architecture and Fabrication
This chapter begins with a section explaining market segmentation of today’s white LED products. For deeper understanding of LED devices and...
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Study of Laser Lift-Off Process for Fabrication of GaN-Based 365-nm Ultraviolet Absorption Layer Removed Flip Chip LED
The objective of this study was to develop a fabrication process to realize feasible n-type GaN thinning on a 365-nm flip chip ultraviolet LED for...
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Si-integrated ferroelectrics for photonics and optical computing
The von Neumann computer architecture is experiencing difficulties with both scaling and power consumption requirements, and as a result, new...
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Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP
The current trend of electrical devices development is progressing towards miniaturization, multi-function and high density, device integration and...
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Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler
In this work, the electroplating of copper pillar bumps in wafer used for chip-scale interconnect was investigated. It was found that the shear...
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Ultrafast pyroelectric photodetection with on-chip spectral filters
Thermal detectors, such as bolometric, pyroelectric and thermoelectric devices, are uniquely capable of sensing incident radiation for any...
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Materials for ultra-efficient, high-speed optoelectronics
High-speed optoelectronics is central to many important developments in the communication, computing, sensing, imaging, and autonomous vehicle...
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Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection
Electroplating of metal bumps is a promising method for the integration of micro-light-emitting diodes (Micro-LED) due to its advantages of fast...
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On the optimization of molding warpage for wafer-level glass interposer packaging
Through-glass-via (TGV) technology has great potential for various applications in advanced electronic packaging and integrated passive devices due...
