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Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler

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Abstract

In this work, the electroplating of copper pillar bumps in wafer used for chip-scale interconnect was investigated. It was found that the shear strength of copper pillar bumps sharply dropped and accordingly the fracture changed from ductile mode into brittle mode with the increase of leveler-Janus green B (JGB) concentration in electrolyte. Severe embrittlement could even cause a spontaneous fracture when the JGB concentration was above 20 ppm. It was believed that this severe embrittlement was attributed to the excessive incorporation of JGB into the deposited Cu. Before the JGB desorbed from the cathode, the incorporation amount of JGB into the growing Cu increased to a peak value with the continuous increase of adsorption. Meanwhile, the incorporation amount of JGB was strongly dependent on its concentration in the electrolyte. The severe embrittlement would be caused at the location with peak amount of incorporation within the deposited Cu when the JGB concentration reached a certain value.

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Data availability

The data used to support the findings of this study are available from the corresponding author upon request.

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Acknowledgements

This study was financially supported by the Science and Technology Plan Project of Yunnan province under the Grant No. 202101BC070001-007, Yunnan Science and Technology Major Project under the Grant No. 2019ZE001, and the National Natural Science Foundation of China (NSFC), under the Grant Nos. 51471180 and 51971231. The authors thank Jiangyin Changdian Advanced Packaging Co., Ltd., for providing the required materials and helpful discussion. One of authors, Ding, also acknowledges Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences for offering a fellowship.

Funding

This study was financially supported by the Science and Technology Plan Project of Yunnan province under the Grant No. 202101BC070001-007, Yunnan Science and Technology Major Project under the Grant No. 202002AB080001, and the National Natural Science Foundation of China (NSFC), under the Grant Nos. 51471180 and 51971231.

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Authors and Affiliations

  1. College of Material Science and Engineering, Jiangsu University of Sciences and Technology, Zhenjiang, 212001, People’s Republic of China

    Zi-feng Ding & **ao-**g Wang

  2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People’s Republic of China

    Zi-feng Ding, Wen-dong Wang, **g-dong Guo & Qing-sheng Zhu

  3. Yunnan Tin Group (Holding) Co. Ltd., Kunming, 650000, People’s Republic of China

    Shan-shan Cai

Authors
  1. Zi-feng Ding
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  2. **ao-**g Wang
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  3. Wen-dong Wang
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  4. Shan-shan Cai
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  5. **g-dong Guo
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  6. Qing-sheng Zhu
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Contributions

ZD: Conceptualization, Methodology, Validation, Investigation, Writing—original manuscript, and Writing—Original Draft. XW: Conceptualization, Methodology, Validation, Investigation, and Writing—review and editing. WW: Investigation, Writing—review and editing, and Visualization. SC: Data curation, Conceptualization, Supervision, Project administration, Funding acquisition, and Writing—review and editing. JG: Mechanism verification, and Writing—review and editing. QZ: Project administration, Funding acquisition, and Writing—review and editing.

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Correspondence to **ao-**g Wang or Qing-sheng Zhu.

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Ding, Zf., Wang, Xj., Wang, Wd. et al. Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler. J Mater Sci: Mater Electron 33, 19026–19035 (2022). https://doi.org/10.1007/s10854-022-08741-5

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