![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Article
A direct atomic layer deposition method for growth of ultra-thin lubricant tungsten disulfide films
We describe a direct atomic layer deposition method to grow lubricant tungsten disulfide (WS2) films. The WS2 films were deposited on a Si (100) substrate and a zinc sulfide (ZnS) film coated the Si (100) substra...
-
Article
Influence of crystal structure on friction coefficient of ZnO films prepared by atomic layer deposition
In this work, the influence of crystal structure on the friction coefficient of zinc oxide (ZnO) films was studied. The ZnO films were deposited on a Si (100) substrate using an atomic layer deposition process...
-
Article
Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry
Copper chemical mechanical polishing (CMP) in barrier layer slurries with periodate as oxidant has not been intensively studied. This work presents an investigation into copper tribocorrosion in potassium per...
-
Article
Nanowear pretreatment of AFM tips for reasonable friction force
In a nanoscale friction test, wear of an atomic force microscope (AFM) tip is inevitable. The shape of the worn tip influences the friction force measured. In order to eliminate the influence, nanowear pretrea...
-
Article
Reducing Friction Force of Si Material by Means of Atomic Layer-Deposited ZnO Films
With excellent lubricating property, zinc oxide (ZnO) films are promising candidates to act as protective coatings in Si-based microelectromechanical system devices for the purpose of decreasing friction forc...
-
Article
Nanotribological Behavior of Ultra-thin Al2O3 Films Prepared by Atomic Layer Deposition
Si-based nano/micro-electromechanical system (NEMS/MEMS) devices with contacting and rubbing structures cannot run reliably due to their poor tribological performance. A thin alumina (Al2O3) film is a promising c...
-
Article
Tribo-chemical Behavior of Copper in Chemical Mechanical Planarization
Chemical mechanical planarization/polishing (CMP) of copper has emerged as an important component in semiconductor processing. It involves both chemical and mechanical effects, consisting of several steps such...