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Article
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
This study investigates the dissolution behavior of the Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe C19210 substrates in Sn-9 wt.%Zn solder (SZ) at temperatures of 240°C, 270°C, and 300°C for 5–100 min. The c...
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Article
Exploring mechanism of suppressing void formation at Interface of Sn–9Zn and Cu
This study investigated the effects of solid-state aging on Sn–3Ag–0.5Cu (SAC305) and Sn–9Zn (SZ) solder joints with two Cu electroplated layers: PC-Cu and PCS-Cu. Distinct surface features and impurity levels...
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Article
Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging
In this study, Bi was added to pure Sn to improve its strength and thermal properties. The presence of 2.5 and 5 wt.% Bi in the Sn matrix lowered the melting point of Sn from 232°C to 229°C and 225°C, respecti...
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Article
Open AccessSignificant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration
Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, Cu foils fabricated through electroplating with variou...
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Article
Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition
Electromigration (EM) is considered as a serious issue that threatens the reliability of electronic packaging. For the long-term reliability of the application of pure silver thin films, it is important to inv...
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Article
Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films
Void formation is a critical reliability concern for solder joints in electronic packaging. The control of microstructures and the quantity of impurities in Cu electroplated films significantly affect void for...
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Article
Open AccessObservation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
With the ever-reducing sizes of electronic devices, the problem of electromigration (EM) has become relevant and requires attention. However, only the EM behavior of Sn–Ag solders within the solder joint struc...
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Article
Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration
Silver (Ag) microparticle sintering bonding is a promising die-attach method for power device packaging. In this study, an ultrasonic-assisted bonding method that bonds chestnut-burr-like Ag microparticles rap...
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Article
Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding
Wide bandgap (WBG) power devices have been attracting increasing attention for next-generation electronic applications. Cu–Cu bonding has been developed to accommodate the high temperature and current characte...
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Article
Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy
Alloys with melting points < 150 °C are required for the development of flexible consumer devices. While the eutectic In–48Sn alloy is a promising candidate for these applications, its low tensile strength and...
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Article
Open AccessAuthor Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
An amendment to this paper has been published and can be accessed via a link at the top of the paper.
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Article
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
Fluxes have a negative impact on the environment; as a result, fluxless soldering has become a promising method in electronic packaging. However, detailed studies on fluxless soldering are very rare, especiall...
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Article
Open AccessSuppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging
High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion....
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Article
Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
Oxidation–reduction bonding (ORB) is a promising method to achieve Cu-Cu bonding with copper microparticles by a pressureless and low-temperature process. In this study, the influences of Cu substrates with an...
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Article
Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy
The effects of 0.5 wt% In as well as 0.5 wt% In and 1 wt% Zn double (In & Zn) additions to eutectic Sn58Bi alloy on the microstructure and mechanical properties were investigated. Newly designed In & Zn-added ...
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Article
Open AccessEffect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applica...
