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    Exploring mechanism of suppressing void formation at Interface of Sn–9Zn and Cu

    This study investigated the effects of solid-state aging on Sn–3Ag–0.5Cu (SAC305) and Sn–9Zn (SZ) solder joints with two Cu electroplated layers: PC-Cu and PCS-Cu. Distinct surface features and impurity levels...

    Yu-An Shen, Chan-Ying Lin, Chih-Ming Chen in Journal of Materials Science: Materials in… (2024)