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Article
Flip chip bonding using ink-jet printing technology
In this paper, a bump-forming method for flip chip bonding using ink-jet printing technology is proposed. A flip chip bonded transmission line using ink-jet printed silver bumps consisting of conductive ink co...
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Article
Open AccessFracture analysis of anodically bonded silicon substrates during the CMP process
In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavi...
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Article
Silicon-on-quartz bonding based SPR chip
In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Mu...
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Article
Open AccessTransmission line printed using silver nanoparticle ink on FR-4 and polyimide substrates
In this paper, nano-silver ink-jet printed transmission lines were fabricated to investigate RF performance on both flame retardant (FR-4) and polyimide (PI) as rigid and flexible substrates. The transmission ...
