Abstract
In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is \(30\; \times \;30\; \times \;1 {\text{mm}}^{3}\). Resonance angle and reflectance are measured to be 42.19° and 0.411°, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.
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Acknowledgments
This work was supported by FACEPE-Brazil (APQ112030410), CNPq-Brazil (56066520105), the Spanish Ministry of Economy and Competitiveness project PIB2010BZ-00585 and NRF–Korea (NRF–2013K2A1A2049144, NRF-2014R1A1A2055653) part of this work has been supported by the Generalitat de Catalunya under Grant 2014 SGR 1551.
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J.-M. Kim and E. Fontana contributed equally.
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Lee, Y., Sim, Sm., Fontana, E. et al. Silicon-on-quartz bonding based SPR chip. Microsyst Technol 23, 1983–1989 (2017). https://doi.org/10.1007/s00542-016-2960-x
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DOI: https://doi.org/10.1007/s00542-016-2960-x