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Chapter
Germanium Deep-Submicron p-FET and n-FET Devices, Fabricated on Germanium-On-Insulator Substrates
A key challenge in the engineering of Ge MOSFETs is to develop a proper Ge surface passivation technique prior to high-κ dielectric deposition to obtain low interface state density and high carrier mobility. A...
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Chapter
Advanced High-Mobility Semiconductor-on-Insulator Materials
Silicon-on-Insulator (SOI) is today the substrate of choice for several applications. In order to boost further circuit performance, new solutions are being explored. In particular, increasing the charge carri...
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Article
An irreversible disappearance of the mechanical loss peak of an yttria-doped silicon nitride
The internal friction of a silicon nitride with a sintering aud of yttrium oxide was measured from room temperature to 1400 °C. A mechanical loss peak was typically observed at 1000 °C on heating the as-sinter...
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Article
Dislocation structure in low-angle interfaces between bonded Si(001) wafers
Dislocation structures of interfaces between bonded (001) Si wafers with co-existing low-angle twist and tilt misorientations were studied by transmission electron microscopy. At dominating twist, a square scr...
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Article
Linear strain hardening in elastoplastic indentation contact
Finite-element analyses for elastoplastic cone indentations were conducted in which the effect of linear strain hardening on indentation behavior was intensively examined in relation to the influences of the f...
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Article
New layer transfers obtained by the SmartCut process
The SmartCut process was first developed to obtain silicon-on-insulator (SOI) materials. Now an industrial process, the main Unibond SOI-structure trends are reported in this paper. Many material combinations ...
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Chapter
Mechanical Properties of Carbon-Carbon Composites
Carbon fibre reinforced carbon-matrix composites (C/C) are now applied as structural materials in aerospace applications and in the space plane because of their high specific strength and specific modulus. C/C...
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Article
Divorced eutectic and interface characteristics in a solidified YAG-spinel composite with spinel-rich composition
Solidified microstructures of YAG (Y3Al5O12)-spinel (MgAl2O4) composite with spinel-rich composition (YAG : spinel = 1 : 30 molar ratio) were investigated. Intergranular YAG divorced eutectic exhibiting fine-grai...
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Article
Large-area wafer bonding of GaAs using hydrogen and ultrahigh vacuum atmospheres
Uniform direct or fusion wafer bonding of GaAs wafers up to 4 inch in diameter was achieved by means of two methods: (i) pre-heating, bonding at elevated temperatures and post-annealing in a H2 atmosphere (gas en...
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Article
Atomic structure of Al/Al interface formed by surface activated bonding
Single crystalline Al crystals were bonded via surface activated bonding at room temperature with the crystallographic orientation of (111)∥(111) and [110]∥[110]. The interfacial microstructure was investigate...
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Article
Metastable precipitation in isothermally solidified YAG-alumina composites with off-eutectic composition
YAG-alumina composites with Al2O3-rich and YAG-rich compositions were prepared by annealing the hot-pressed composites at the eutectic temperature (1820°C) for 1 h followed by cooling down at 10 or 100°C/min in a...
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Article
Metastable precipitation of YAIO3 in isothermally solidified YAG/(Al2O3-rich) spinel composites
Phase composition and microstructure of isothermally solidified YAG/spinel (or Al2O3-rich solid solution) composites were investigated. It was verified that an equilibrium binary eutectic phase region consisti...
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Article
Anisotropy of creep deformation rate in hot-pressed Si3N4 with preferred orientation of the elongated grains
Compressive creep deformation of hot-pressed silicon nitride with two different preorientations of grain was investigated at temperatures in the range of 1300–1400 °C under 30–100 MPa. The stress exponent of t...
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Article
Shear strength of C/C composites containing an inorganic compound effective for anti-oxidation
Abstracts are not published in this journal
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Article
Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method
Sapphire (α–Al2O3) and Al were joined by means of the surface activated bonding (SAB) method in an ultrahigh vacuum at room temperature. Tensile tests have shown that failure occurred not along the interface but ...
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Chapter
Mechanical Properties of SiC Whisker / Si3N4 Composite Prepared by an in-situ Method
During the last decade, we have investigated the in-situ whiskerization of SiC in the Si3N4 matrix, for the purpose, not only of improving the homogeneity of composite formed, but also of avoiding direct handling...
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Article
A nationwide epidemiological survey of spinal cord injuries in Japan from January 1990 to December 1992
This survey of traumatic spinal cord injuries in Japan from January 1990 to December 1992 was carried out by a statistical method of the nationwide epidemiological study. The number of the registered patients ...
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Article
Selective intrathecal phenol block to improve activities of daily living in patients with spastic quadriplegia. A preliminary report
To eliminate severe leg spasms of 15 quadriplegics, 0.3 ml 10% phenol-glycerin was injected into the subarachnoid space at the T12/L1 interspace. The effectiveness for leg spasm was evaluated by the Penn spast...
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Article
Spinal cord injuries in Japan: a nationwide epidemiological survey in 1990
To survey the situation of traumatic spinal cord injuries (SCI) in Japan, the SCI Prevention Committee of the Japanese Medical Society of Paraplegia sent out by mail study charts in the form of questionnaires...
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Article
Over-distension therapy of the bladder in paraplegic patients using self-catheterisation: a preliminary study
Over-distension therapy was performed in 60 patients during the period of spinal shock after complete spinal cord injury.
