-
Article
Experimental Observation of Diffusion Reaction in the (Sn-Ag)/Cu System at Solid-State Temperatures
The diffusion reaction kinetics for Sn-Ag alloys with pure Cu has been examined experimentally to determine the effects of adding Ag to Sn on the growth behavior of compounds at a heated interface between a Sn...
-
Article
Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn
The Cu/Sn system is one of the most fundamental and important metallic systems for solder joints in electric devices. To realize reliable solder joints, information on reactive diffusion at the solder joint is...
-
Article
Open AccessPrognostic implications of CEBPA mutations in pediatric acute myeloid leukemia: a report from the Japanese Pediatric Leukemia/Lymphoma Study Group
CCAAT/enhancer-binding protein alpha (CEBPA) mutations are a favorable prognostic factor in adult acute myeloid leukemia (AML) patients; however, few studies have examined their significance in pediatric AML pati...
-
Article
Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures
The kinetics of solid-state reactive diffusion in the (Pd-Cu)/Sn system was experimentally observed to examine how adding Cu into Pd influenced the growth behavior of compounds at the junction between the Sn-b...
-
Article
Influence of head-tip morphology on contact properties for microconnector of Ni–Co alloy
To examine experimentally the influence of head-tip morphology on electrical and mechanical properties at the contact with a phosphor bronze, cantilever-type microconnectors of Ni–Co alloys were prepared by an...
-
Article
Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System
The kinetics of solid-state reactive diffusion in the (Ni-Cr)/Sn system was experimentally observed to examine the influence of the addition of Cr into Ni on the growth behavior of compounds at the interconnec...
-
Article
Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al
To examine experimentally the kinetics of the reactive diffusion between solid-Cu and solid-Al, sandwich Al/Cu/Al diffusion couples were prepared by a diffusion-bonding technique and then isothermally annealed...
-
Article
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System
The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influenc...
-
Article
Diffusion-induced recrystallization in the Cu(Pd) system at complete solid-solution temperatures
Owing to annealing at complete solid-solution temperatures around 1,000 K, Pd can quickly penetrate into Cu due to diffusion-induced recrystallization (DIR). To examine this penetration behavior, DIR in the Cu...
-
Article
Kinetics of isothermal reactive diffusion between solid Fe and liquid Al
The kinetics of the reactive diffusion between solid Fe and liquid Al was experimentally observed using Fe/Al diffusion couples. The diffusion couples were prepared by an isothermal bonding technique and then ...
-
Article
Kinetics of reactive diffusion between Ta and Cu–9.3Sn–0.3Ti alloy
Tantalum is used as a diffusion barrier in the superconducting Nb3Sn composite-wire manufactured by the bronze method. In order to examine the consumption behavior of the Ta barrier during annealing in the bronze...
-
Article
Numerical analysis for migration of austenite/ferrite interface during carburization of Fe
During isothermal annealing of the ferrite of a binary Fe–C alloy in an appropriate carburization atmosphere at temperatures of 1020–1180 K, the austenite will be formed as a layer on the surface of the ferrit...
-
Article
Kinetics of Diffusion-Induced Recrystallization in the Cu(Ni) System at Low Temperatures
During annealing at temperatures around 800 K, Ni can quickly penetrate into Cu due to diffusion-induced recrystallization (DIR). To examine this penetration rate, the kinetics of DIR in the Cu(Ni) system was ...
-
Article
Quantitative analysis for kinetics of reactive diffusion in the Fe–Cr system
In the binary Fe–Cr system, the γ phase with the face-centered cubic structure becomes a stable intermediate phase sandwiched between the Fe-rich α1 and Cr-rich α2 phases with the body-centered cubic structure in...
-
Article
Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K
The kinetics of the reactive diffusion between Au and Sn was experimentally studied in a metallographical manner. Sn/Au/Sn diffusion couples were prepared by a solid-state diffusion bonding technique and then ...
-
Article
Microstructure Observations for Diffusion Induced Recrystallization and Diffusion Induced Grain Boundary Migration on Surfaces of Zincified Cu Bicrystals With [1 1 0] Twist Boundaries
The formation behavior of the fine-grain region alloyed with Zn due to diffusion induced recrystallization (DIR) in the Cu(Zn) system was experimentally examined for the surfaces polished in different manners ...
-
Article
Formation and stability of a nitride with the structure of beta manganese in Ni-Cr-N ternary system
A nitride with the metal-atom arrangement of β manganese, which is designated as π phase, was confirmed to exist as an equilibrium phase in the ternary Cr-Ni-N system. A Cr-40 mass pct Ni binary alloy was nitr...
-
Article
Thermodynamic evaluation of the Cr-Ni-C system
Evaluation of thermodynamic parameters of the Cr-C and Cr-Ni-C systems has been made by using sublattice models. The Gibbs energies of formation of Cr23C6, Cr7C3, and Cr3C2 were reassessed from the experimental d...
-
Article
Activity of carbon in nickel-rich Ni-Mo and Ni-W alloys
Effects of molybdenum and tungsten on carbon activity in nickel have been experimentally determined at 1000, 1100, and 1200 °C. Seventeen nickel-molybdenum and thirteen nickel-tungsten binary alloys were carbu...
-
Article
Clinicopathological study on subacute hepatitis (III); The differential diagnosis at the early stage
