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  1. Article

    Open Access

    Wear behavior of copper material removal during fluid jet polishing: A comparative study between experiment and simulation

    As a crucial part in micro-electromechanical manufacture, local ultra-precision processing of highly ductile copper is expected to be realized by fluid jet polishing (FJP), which widely utilized in optical ele...

    Wen**g Zhang, **n Zhang, Tiancheng Ai, Dan Guo, Guoshun Pan in Friction (2024)

    Download PDF (5470 KB)

  2. No Access

    Article

    Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing

    SiO2 based slurry was an ideal solution for addressing element pollution in fused silica polishing. However, it was still a huge challenge to enhance polishing efficiency. Herein, lignin was added into colloidal ...

    Gaopan Chen, Haimei Luo, Yan Zhou, Liyan Pan, Guihai Luo, Guoshun Pan in Silicon (2023)

  3. Article

    Open Access

    Atomic Step Formation on Sapphire Surface in Ultra-precision Manufacturing

    Surfaces with controlled atomic step structures as substrates are highly relevant to desirable performances of materials grown on them, such as light emitting diode (LED) epitaxial layers, nanotubes and nanori...

    Rongrong Wang, Dan Guo, Guoxin **e, Guoshun Pan in Scientific Reports (2016)

    Download PDF (6717 KB) View Article

  4. Article

    Open Access

    Mechanical model of nanoparticles for material removal in chemical mechanical polishing process

    Chemical mechanical polishing (CMP) is the most effective method for surface planarization in the semiconductor industry. Nanoparticles are significant for material removal and ultra-smooth surface formation. ...

    Hao Chen, Dan Guo, Guoxin **e, Guoshun Pan in Friction (2016)

    Download PDF (1816 KB)

  5. No Access

    Article

    AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP)

    The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studied through X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. XPS results...

    Yan Zhou, Guoshun Pan, **aolei Shi, Hua Gong… in Journal of Materials Science: Materials in… (2015)

  6. No Access

    Article

    The Assessment of Interface Adhesion of Cu/Ta/Black Diamond™/Si Films Stack Structure by Nanoindentation and Nanoscratch Tests

    The interface adhesion of the Cu/Ta/Black Diamond™ (SiOC:H, BD, low-k)/Si substrate films stack structure was investigated. During the nanoindentation tests, a series of indentations under varied maximum normal l...

    Chenglong Liao, Dan Guo, Shizhu Wen, **nchun Lu, Guoshun Pan… in Tribology Letters (2014)

  7. No Access

    Article

    Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

    Due to its high mechanical hardness and excellent chemical inertness, SiC single-crystal wafer is extremely difficult to realize effectively removed total planarization. Owing to crystalline polarity and aniso...

    Guoshun Pan, Yan Zhou, Guihai Luo… in Journal of Materials Science: Materials in… (2013)

  8. No Access

    Article

    A comparative study between graphene oxide and diamond nanoparticles as water-based lubricating additives

    The tribological properties of graphene oxide (GO) nanosheets and modified diamond (MD) nanoparticles with excellent water-solubility were investigated. GO nanosheets were synthesized using carbon fibers with ...

    YuHong Liu, **aoKang Wang, GuoShun Pan, JianBin Luo in Science China Technological Sciences (2013)

  9. No Access

    Article

    Modification on the tribological properties of ceramics lubricated by water using fullerenol as a lubricating additive

    It is necessary to modify the running-in process for the application of ceramics using water as a lubricant in real conditions because ceramics sliding in water are characterized by a running-in period with se...

    YuHong Liu, **aoKang Wang, Peng**ao Liu… in Science China Technological Sciences (2012)

  10. No Access

    Article

    Film Thickness of Ionic Liquids Under High Contact Pressures as a Function of Alkyl Chain Length

    Ionic liquids are generally considered as environmentally friendly material. The film thicknesses of ionic liquids and silicone oils at high pressures up to 3 GPa are measured employing the relative optical in...

    Dan Guo, Shuhai Liu, Guoshun Pan, **nchun Lu in Tribology Letters (2011)

  11. No Access

    Chapter and Conference Paper

    Effect of Ingredients in Slurry Containing Alumina on Polishing of Hard Disk Substrate

    Large Material Remove Rate (MRR) and high surface quality have to be achieved at the same time in the primary polishing of hard disk substrate. Alumina abrasive, with a high hardness, is widely used to meet th...

    Jiazhen Sun, Yan Zhou, Jianbin Luo, Yan Liu, Guoshun Pan, Yonghua Zhu… in Advanced Tribology (2010)

  12. No Access

    Chapter and Conference Paper

    Chemical Mechanical Planarization of Copper Using Ethylenediamine and Hydrogen Peroxide Based Slurry

    Chemical-mechanical planarization (CMP) of copper is a committed step hi the IC manufacturing. In this work, the slimy including ethylenediamine and hydrogen peroxide was studied. Result showed that the materi...

    ** Liu, **nchun Lu, Yuhong Liu, Jianbin Luo, Guoshun Pan in Advanced Tribology (2010)

  13. No Access

    Chapter and Conference Paper

    Experimental Study of Ultrasonic Vibration Assisted Chemical Mechanical Polishing for Sapphire Substrate

    Sapphire is an important substrate material widely used in a range of applications such as optics, electrics, and IC industry. In many of those applications, critical surface quality demands of sapphire are re...

    Wenhu Xu, **nchun Lu, Guoshun Pan, Jianbin Luo, Chenhui Zhang in Advanced Tribology (2010)

  14. No Access

    Chapter and Conference Paper

    Particles Detection and Analysis of Hard Disk Substrate after Post-CMP Cleaning

    Scrub, ultrasonic and megasonic are widely used in industry as post-CMP cleaning procedure. In this paper, experiments are taken to analyze the particle contaminations after each process. A scatter spot method...

    Yating Huang, **nchun Lu, Guoshun Pan, Bill Lee, Jianbin Luo in Advanced Tribology (2010)

  15. No Access

    Chapter and Conference Paper

    Mechanism and Applications of Chemical and Mechanical Polishing

    The mechanism of chemical mechanical polishing (CMP) is so complicated because there is synergy between chemical and mechanical action. We studied the effect of particels in CMP by MD simulation theoreticaly a...

    **nchun Lu, Guoshun Pan, Jianbin Luo in Advanced Tribology (2010)

  16. No Access

    Article

    Progress in material removal mechanisms of surface polishing with ultra precision

    Chemical mechanical polishing (CMP) process is commonly regarded as the best method for achieving global planarization in the field of surface finishing with ultra-precision. The development of investigation o...

    ** Xu, Jianbin Luo, **nchun Lu, Chaohui Zhang, Guoshun Pan in Chinese Science Bulletin (2004)

  17. No Access

    Article

    Structural and mechanical properties of nano-crystal TiN coatings

    The structural and mechanical properties of TiN coatings prepared by ion beam assisted deposition (IBAD) were studied. The coatings have a polycrystal structure with grain size of ≈10nm or less. The hardness o...

    Chenhui Zhang, Guoshun Pan, Jianbin Luo… in Science in China Series G: Physics, Mechan… (2004)