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Article
Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method
The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity, calling for Pb-free substitute materials. Sn–Ag alloy is a potential candidate in terms of good mechanical property. The major...
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Article
Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression
The Sn3.0Ag0.5Cu (wt%) lead-free solder alloy is considered to be one of the most promising alternatives to replace the traditionally used Sn–Pb solders. This alloy composition possesses, however, some weaknes...
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Article
Cooling rate dependence of undercooling of pure Sn single drop by fast scanning calorimetry
Non-adiabatic fast scanning calorimetry has been developed to in-situ measure the response of single metallic drops to temperature changes in a large range of cooling rate spanning four orders of magnitude. In...
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Article
Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder
The traditional Sn–Pb eutectic solder alloys are being phased out from the electronics industry due to the toxicity of lead (Pb), leading to the development and implementation of lead-free solders. Sn3.5Ag lea...
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Article
Size-dependent undercooling of pure Sn by single particle DSC measurements
The size-dependent solidification undercooling was investigated for single micro-sized particles of pure Sn employing differential scanning calorimeter (DSC). The particles were obtained from a solvent-encapsu...
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Article
Fast calorimetric scanning of micro-sized SnAgCu single droplet at a high cooling rate
The undercooling of the single micro-sized droplet of Sn-3.0Ag-0.5Cu (wt%) alloy has been studied via the newly developed fast calorimetric scanning technique, by which the fast heating and cooling treatment f...
