42 Result(s)

Article

Electromagnetic modeling of periodically-structured fiber-reinforced single-layer laminate with multiple fibers missing

Modeling of periodically-structured, fiber-reinforced laminates with fibers missing is investigated, this applying as well to similarly disorganized photonic crystals at optical frequencies. Parallel cylindric...

Z.-C. Liu, C.-Y. Li, D. Lesselier, Y. Zhong in Applied Physics A (2016)

Article

Electromagnetic small-scale modeling of composite panels involving periodic arrays of circular fibers

Electromagnetic modeling of composite panels as planar multilayers involving a periodic set of circular cylindrical fibers in each constitutive layer is considered. As a first step, the case of a single layer ...

C. Y. Li, D. Lesselier, Y. Zhong in Applied Physics A (2014)

Article

Variable-rate colour image quantization based on quadtree segmentation

A novel variable-sized block encoding with threshold control for colour image quantization (CIQ) is presented in this paper. In CIQ, the colour palette used has a great influence on the reconstructed image qua...

Y. C. Hu, C. Y. Li, J. C. Chuang, C. C. Lo in Opto-Electronics Review (2011)

Article

A Study on the Properties of Different IMP Ta, Ta(N) and Multi-Layer Ta/Ta(N) as Diffusion Barriers for Cu Metallization

We report a study on the properties of Ionized Metal Plasma (IMP) Ta, Ta(N) and multi-layer Ta/Ta(N) based on a comparative evaluation of their performance as diffusion barriers in Cu based metallization schem...

L. He, C. Y. Li, Z. Q. Zeng, J. J. Wu, Y. Qian, Y. Zhang… in MRS Online Proceedings Library (2011)

Article

Efficient greyscale image compression technique based on vector quantization

In this paper, a novel greyscale image coding technique based on vector quantization (VQ) is proposed. In VQ, the reconstructed image quality is restricted by the codebook used in the image encoding/decoding p...

Y. C. Hu, J. C. Chuang, C. C. Lo, C. Y. Li in Opto-Electronics Review (2011)

Article

A Correlation Study of Thermal Stability on Porous Low k

The thermal stability of organic porous low k, porous SiLK with a dielectric constant of 2.4, has been studied. Organic low k material SiLK^TM, non-porous SiLK, with a dielectric constant 2.8 is used as a baseline...

Y. F. Chow, T. H. Foo, L. Shen, J. S. Pan, A. Y. Du… in MRS Online Proceedings Library (2011)

Article

Diffusion Studies of Cu in Si and Low-k Dielectric Materials

Experimental results are presented on the diffusion of Cu in silicon and Black Diamond¶ (BD). Cu coated silicon samples, with and without the BD layer, are annealed at various temperatures and times. It is con...

K. Prasad, X. L. Yuan, C. M. Tan, D. H. Zhang, C. Y. Li… in MRS Online Proceedings Library (2011)

Article

Large-scale synthesis of single-phase, high-quality GaN nanocrystallites

Large-scale synthesis of high-quality GaN nano-crystallites has been achieved by direct reaction of a 4:1 molar Ga/Ga₂O₃ mixture with ammonia at 950 °C. X-ray diffraction, transmission electron microscopy, select...

J.C. Wang, D.P. Yu, C.Y. Li, J.F. Zhou, Y.Z. Wang, S.Q. Feng in Applied Physics A (2004)

Article

Electromobility of plasmid DNA in tumor tissues during electric field-mediated gene delivery

Interstitial transport is a crucial step in plasmid DNA-based gene therapy. However, interstitial diffusion of large nucleic acids is prohibitively slow. Therefore, we proposed to facilitate interstitial trans...

D A Zaharoff, R C Barr, C-Y Li, F Yuan in Gene Therapy (2002)

Article

Commentary on polymer crystallization: Selection rules in different length scales of a nucleation process

S.Z.D. Cheng, C.Y. Li, L. Zhu in The European Physical Journal E (2000)

Article

Electromigration Modeling of Blech Experiment with Comparison to Recent Experimental Data

Finite element analysis is applied to simulate electromigration in a copper line/tungsten junction, which is a typical structure in Blech experiments adopted to measure the electromigration drift velocity by e...

Zhineng Fan, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1999)

Article

Under Bump Metallization Development for Eutectic Pb-Sn Solders

Due to its advantage in number of I/Os over other interconnection method, flip chip interconnection technology plays a key role in today’s electronics packaging. Good understanding of interfacial reactions bet...

S. J. Hong, T. M. Korhonen, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

Article

Flip Chip Metallurgies for Lead-Free Solders

The most commonly used lead-free solders contain large amounts of tin, which makes them incompatible with the conventional Cu-based underbump metallization (UBM) schemes. The tin in the solder reacts with the ...

T. M. Korhonen, S. J. Hong, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

Article

Low Stress under Bump Metallizations for Direct Chip Attach

In order to use a flip chip method for bonding the Si chip directly to an organic substrate, compatible under bump metallization (UBM) must be available. Conventional schemes with a copper-based solderable lay...

P. Su, T. M. Korhonen, S. J. Hong, M. A. Korhonen… in MRS Online Proceedings Library (1998)

Article

Study of Practical Adhesion of Metals to Glass Substrates

Metallic coatings on glass substrates are widely used in various microelectronic components. However, sometimes high residual stress generated in the deposition process or after leads to the loss of adhesion b...

C. Zhou, P. Su, M. A. Korhonen, C. Y. Li in MRS Online Proceedings Library (1998)

Article

Under Bump Metallization Development for High Sn Solders

Several under bump metallisation (UBM) schemes using Ni or CuNi alloys as the solderable layer were investigated. Cr or Ti was used as the adhesion layer. The UBM pads of different compositions were sputter de...

T. M. Korhonen, S. J. Hong, P. Su, C. Zhou… in MRS Online Proceedings Library (1997)

Article

Fiber Optic Sensing of Cyanides in Solutions

A novel sol-gel technique was used to immobilize malachite green ions (MG⁺) in stable, optically transparent, porous silica gel films. A simple and sensitive method was developed for the detection of cyanides in ...

S. S. Park, J. D. Mackenzie, C. Y. Li, P. Guerreiro… in MRS Online Proceedings Library (1996)

Article

Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

In narrow metal lines used for chip level interconnects, the line width can strongly affect the electromigration reliability, typically due to variations in the microstructure and in the mechanical stress stat...

D. D. Brown, J. E. Sanchez Jr., V. Pham, P. R. Besser… in MRS Online Proceedings Library (1996)

Article

Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

Reliability of solder interconnects is normally characterized by extrapolation of bulk solder reliability data, such as crack growth measurements of solder materials in the bulk form. In the present study, exp...

Tao Liu, M. A. Korhonen, S. Ting, D. Kim, C.-Y. Li in MRS Online Proceedings Library (1995)

Article

Stress-Voiding and Electromigration in Multilevel Interconnects

Stress-voiding and electromigration have become urgent reliability concerns at the decrease of interconnect dimensions to submicron size. Severe stress voiding may arise in multilevel metallizations, particula...

M. A. Korhonen, Tao Liu, D. D. Brown, C.-Y. Li in MRS Online Proceedings Library (1995)