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  1. No Access

    Article

    Variable-rate colour image quantization based on quadtree segmentation

    A novel variable-sized block encoding with threshold control for colour image quantization (CIQ) is presented in this paper. In CIQ, the colour palette used has a great influence on the reconstructed image qua...

    Y. C. Hu, C. Y. Li, J. C. Chuang, C. C. Lo in Opto-Electronics Review (2011)

  2. No Access

    Article

    A Study on the Properties of Different IMP Ta, Ta(N) and Multi-Layer Ta/Ta(N) as Diffusion Barriers for Cu Metallization

    We report a study on the properties of Ionized Metal Plasma (IMP) Ta, Ta(N) and multi-layer Ta/Ta(N) based on a comparative evaluation of their performance as diffusion barriers in Cu based metallization schem...

    L. He, C. Y. Li, Z. Q. Zeng, J. J. Wu, Y. Qian, Y. Zhang… in MRS Online Proceedings Library (2011)

  3. No Access

    Article

    Efficient greyscale image compression technique based on vector quantization

    In this paper, a novel greyscale image coding technique based on vector quantization (VQ) is proposed. In VQ, the reconstructed image quality is restricted by the codebook used in the image encoding/decoding p...

    Y. C. Hu, J. C. Chuang, C. C. Lo, C. Y. Li in Opto-Electronics Review (2011)

  4. No Access

    Article

    A Correlation Study of Thermal Stability on Porous Low k

    The thermal stability of organic porous low k, porous SiLK with a dielectric constant of 2.4, has been studied. Organic low k material SiLKTM, non-porous SiLK, with a dielectric constant 2.8 is used as a baseline...

    Y. F. Chow, T. H. Foo, L. Shen, J. S. Pan, A. Y. Du… in MRS Online Proceedings Library (2011)

  5. No Access

    Article

    Diffusion Studies of Cu in Si and Low-k Dielectric Materials

    Experimental results are presented on the diffusion of Cu in silicon and Black Diamond¶ (BD). Cu coated silicon samples, with and without the BD layer, are annealed at various temperatures and times. It is con...

    K. Prasad, X. L. Yuan, C. M. Tan, D. H. Zhang, C. Y. Li… in MRS Online Proceedings Library (2011)

  6. No Access

    Article

    Phase structures, transition behavior and surface alignment in polymers containing rigid-rod backbones with flexible side chains Part VI Novel band structures in a combined main-chain/side-chain liquid crystalline polyester: From liquid crystal to crystalline states

    Physical origins of banded structures appearing on different length scales have been investigated using polarized light and atomic force microscopies (PLM and AFM), polarized Fourier Transform infrared spectro...

    J. J. Ge, J. Z. Zhang, Wensheng Zhou, C. Y. Li, Shi **… in Journal of Materials Science (2000)

  7. No Access

    Article

    Electromigration Modeling of Blech Experiment with Comparison to Recent Experimental Data

    Finite element analysis is applied to simulate electromigration in a copper line/tungsten junction, which is a typical structure in Blech experiments adopted to measure the electromigration drift velocity by e...

    Zhineng Fan, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1999)

  8. No Access

    Article

    Under Bump Metallization Development for Eutectic Pb-Sn Solders

    Due to its advantage in number of I/Os over other interconnection method, flip chip interconnection technology plays a key role in today’s electronics packaging. Good understanding of interfacial reactions bet...

    S. J. Hong, T. M. Korhonen, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

  9. No Access

    Article

    Flip Chip Metallurgies for Lead-Free Solders

    The most commonly used lead-free solders contain large amounts of tin, which makes them incompatible with the conventional Cu-based underbump metallization (UBM) schemes. The tin in the solder reacts with the ...

    T. M. Korhonen, S. J. Hong, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

  10. No Access

    Article

    Low Stress under Bump Metallizations for Direct Chip Attach

    In order to use a flip chip method for bonding the Si chip directly to an organic substrate, compatible under bump metallization (UBM) must be available. Conventional schemes with a copper-based solderable lay...

    P. Su, T. M. Korhonen, S. J. Hong, M. A. Korhonen… in MRS Online Proceedings Library (1998)

  11. No Access

    Article

    Study of Practical Adhesion of Metals to Glass Substrates

    Metallic coatings on glass substrates are widely used in various microelectronic components. However, sometimes high residual stress generated in the deposition process or after leads to the loss of adhesion b...

    C. Zhou, P. Su, M. A. Korhonen, C. Y. Li in MRS Online Proceedings Library (1998)

  12. No Access

    Article

    Under Bump Metallization Development for High Sn Solders

    Several under bump metallisation (UBM) schemes using Ni or CuNi alloys as the solderable layer were investigated. Cr or Ti was used as the adhesion layer. The UBM pads of different compositions were sputter de...

    T. M. Korhonen, S. J. Hong, P. Su, C. Zhou… in MRS Online Proceedings Library (1997)

  13. No Access

    Article

    Fiber Optic Sensing of Cyanides in Solutions

    A novel sol-gel technique was used to immobilize malachite green ions (MG+) in stable, optically transparent, porous silica gel films. A simple and sensitive method was developed for the detection of cyanides in ...

    S. S. Park, J. D. Mackenzie, C. Y. Li, P. Guerreiro… in MRS Online Proceedings Library (1996)

  14. No Access

    Article

    Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

    In narrow metal lines used for chip level interconnects, the line width can strongly affect the electromigration reliability, typically due to variations in the microstructure and in the mechanical stress stat...

    D. D. Brown, J. E. Sanchez Jr., V. Pham, P. R. Besser… in MRS Online Proceedings Library (1996)

  15. No Access

    Article

    Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

    Reliability of solder interconnects is normally characterized by extrapolation of bulk solder reliability data, such as crack growth measurements of solder materials in the bulk form. In the present study, exp...

    Tao Liu, M. A. Korhonen, S. Ting, D. Kim, C.-Y. Li in MRS Online Proceedings Library (1995)

  16. No Access

    Article

    Stress-Voiding and Electromigration in Multilevel Interconnects

    Stress-voiding and electromigration have become urgent reliability concerns at the decrease of interconnect dimensions to submicron size. Severe stress voiding may arise in multilevel metallizations, particula...

    M. A. Korhonen, Tao Liu, D. D. Brown, C.-Y. Li in MRS Online Proceedings Library (1995)

  17. No Access

    Article

    The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

    In near-bamboo interconnect lines used in advanced integrated circuits, electromigration flux divergences occur at the intersection between polycrystalline cluster segments (where grain boundaries offer a fast...

    D. D. Brown, J. E. Sanchez Jr., P. R. Besser… in MRS Online Proceedings Library (1995)

  18. No Access

    Article

    Predicting and Comparing Electromigration Failure for Different Test Structures

    Electromigration and stress migration are important reliability concerns in the semiconductor industry. Relative and absolute assessments of lifetimes generally rely on the accelerated testing of ‘standard’ te...

    D. D. Brown, M. A. Kortionen, P. Børgesen, C.-Y. Li in MRS Online Proceedings Library (1994)

  19. No Access

    Article

    Stress-Voiding and Electromigration in Multilevel Interconnect Metallizations

    Stress-voiding or stress migration (SM), and electromigration (EM) are urgent problems in ULSI microcircuits with features in the submicron range. Severe stress-voiding arises in multilevel metallizations beca...

    M. A. Korhonen, D. D. Brown, C. -Y. Li, H. S. Rathore in MRS Online Proceedings Library (1994)

  20. No Access

    Article

    Micromechanical Testing of Electronic Packaging Components and Materials

    Mechanical modelling of microelectronic packages for design optimization requires the quantitative knowledge of a large number of physical parameters. Because of the composite nature of many components, and be...

    C.-Y. Li, B. Yost, M. A. Korhonen, J. Dion in MRS Online Proceedings Library (1993)

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